ZHCSNR7A March   2022  – August 2022 TPS55289

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VCC Power Supply
      2. 7.3.2  EXTVCC Power Supply
      3. 7.3.3  Operation Mode Setting
      4. 7.3.4  Input Undervoltage Lockout
      5. 7.3.5  Enable and Programmable UVLO
      6. 7.3.6  Soft Start
      7. 7.3.7  Shutdown and Load Discharge
      8. 7.3.8  Switching Frequency
      9. 7.3.9  Switching Frequency Dithering
      10. 7.3.10 Inductor Current Limit
      11. 7.3.11 Internal Charge Path
      12. 7.3.12 Output Voltage Setting
      13. 7.3.13 Output Current Monitoring and Cable Voltage Droop Compensation
      14. 7.3.14 Output Current Limit
      15. 7.3.15 Overvoltage Protection
      16. 7.3.16 Output Short Circuit Protection
      17. 7.3.17 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 Power Save Mode
    5. 7.5 Programming
      1. 7.5.1 Data Validity
      2. 7.5.2 START and STOP Conditions
      3. 7.5.3 Byte Format
      4. 7.5.4 Acknowledge (ACK) and Not Acknowledge (NACK)
      5. 7.5.5 Target Address and Data Direction Bit
      6. 7.5.6 Single Read and Write
      7. 7.5.7 Multiread and Multiwrite
    6. 7.6 Register Maps
      1. 7.6.1 REF Register (Address = 0h, 1h)
      2. 7.6.2 IOUT_LIMIT Register (Address = 2h) [reset = 11100100h]
      3. 7.6.3 VOUT_SR Register (Address = 3h) [reset = 00000001h]
      4. 7.6.4 VOUT_FS Register (Address = 4h) [reset = 00000011h]
      5. 7.6.5 CDC Register (Address = 5h) [reset = 11100000h]
      6. 7.6.6 MODE Register (Address = 6h) [reset = 00100000h]
      7. 7.6.7 STATUS Register (Address = 7h) [reset = 00000011h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency
        2. 8.2.2.2 Output Voltage Setting
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Output Capacitor
        6. 8.2.2.6 Output Current Limit
        7. 8.2.2.7 Loop Stability
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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订购信息

5 Pin Configuration and Functions

Figure 5-1 21-Pin VQFN-HR RYQ Package (Transparent Top View)
Table 5-1 Pin Functions
Pin I/O Description
Name NO.
EN/UVLO 1 I Enable logic input and programmable input voltage undervoltage lockout (UVLO) input. Logic high level enables the device. Logic low level disables the device and turns it into shutdown mode. After the voltage at the EN/UVLO pin is above the logic high voltage of 1.15 V, this pin acts as programmable UVLO input with 1.23-V internal reference.
MODE 2 I I2C target address selection. When it is connected to the logic high voltage, the I2C target address is 74H. When it is connected to the logic low voltage, the I2C target address is 75H.
SCL 3 I Clock of I2C interface
SDA 4 I/O Data of I2C interface
DITH/SYNC 5 I Dithering frequency setting and synchronous clock input. Use a capacitor between this pin and ground to set the dithering frequency. When this pin is short to ground or pulled above 1.2 V, there is no dithering function. An external clock can be applied at this pin to synchronize the switching frequency.
FSW 6 I The switching frequency is programmed by a resistor between this pin and the AGND pin.
VIN 7 PWR Input of the buck-boost converter
SW1 8 PWR The switching node pin of the buck side. It is connected to the drain of the internal buck low-side power MOSFET and the source of internal buck high-side power MOSFET.
PGND 9 PWR Power ground of the IC
SW2 10 PWR The switching node pin of the boost side. It is connected to the drain of the internal boost low-side power MOSFET and the source of internal boost high-side power MOSFET.
VOUT 11 PWR Output of the buck-boost converter
ISP 12 I Positive input of the current sense amplifier. An optional current sense resistor connected between the ISP pin and the ISN pin can limit the output current. If the sensed voltage reaches the current limit setting value in the register, a slow constant current control loop becomes active and starts to regulate the voltage between the ISP pin and the ISN pin. Connecting the ISP pin and the ISN pin together with the VOUT pin can disable the output current limit function.
ISN 13 I Negative input of the current sense amplifier. An optional current sense resistor connected between the ISP pin and the ISN pin can limit the output current. If the sensed voltage reaches the current limit setting value in the register, a slow constant current control loop becomes active and starts to regulate the voltage between the ISP pin and the ISN pin. Connecting the ISP pin and the ISN pin together with the VOUT pin can disable the output current limit function.
FB/INT 14 I/O When the device is set to use external output voltage feedback, connect to the center tap of a resistor divider to program the output voltage. When the device is set to use internal feedback, this pin is a fault indicator output. When there is an internal fault happening, this pin outputs logic low level.
COMP 15 O Output of the internal error amplifier. Connect the loop compensation network between this pin and the AGND pin.
CDC 16 O Voltage output proportional to the sensed voltage between the ISP pin and the ISN pin. Use a resistor between this pin and AGND to increase the output voltage to compensate voltage droop across the cable caused by the cable resistance.
AGND 17 — Signal ground of the IC
VCC 18 O Output of the internal regulator. A ceramic capacitor of more than 4.7 μF is required between this pin and the AGND pin.
BOOT2 19 O Power supply for high-side MOSFET gate driver in boost side. A 0.1-µF ceramic capacitor must be connected between this pin and the SW2 pin.
BOOT1 20 O Power supply for high-side MOSFET gate driver in buck side. A 0.1-µF ceramic capacitor must be connected between this pin and the SW1 pin.
EXTVCC 21 I Select the internal LDO or external 5 V for VCC. When it is connected to logic high voltage, select the internal LDO. When it is connected to logic low voltage, select the external 5 V for VCC.