ZHCSTG6A July   2023  – October 2023 TPS25984

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Logic Interface
    7. 7.7 Timing Requirements
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Protection
      2. 8.3.2  Insertion Delay
      3. 8.3.3  Overvoltage Protection
      4. 8.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.4.1 Slew Rate (dVdt) and Inrush Current Control
          1. 8.3.4.1.1 Start-Up Time Out
        2. 8.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 8.3.4.3 Active Current Limiting During Start-Up
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5  Analog Load Current Monitor (IMON)
      6. 8.3.6  Mode Selection (MODE)
      7. 8.3.7  Parallel Device Synchronization (SWEN)
      8. 8.3.8  Stacking Multiple eFuses for Unlimited Scalability
        1. 8.3.8.1 Current Balancing During Start-Up
      9. 8.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 8.3.10 Overtemperature Protection
      11. 8.3.11 Fault Response and Indication (FLT)
      12. 8.3.12 Power-Good Indication (PG)
      13. 8.3.13 Output Discharge
      14. 8.3.14 FET Health Monitoring
      15. 8.3.15 Single Point Failure Mitigation
        1. 8.3.15.1 IMON Pin Single Point Failure
        2. 8.3.15.2 ILIM Pin Single Point Failure
        3. 8.3.15.3 IREF Pin Single Point Failure
        4. 8.3.15.4 ITIMER Pin Single Point Failure
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Standalone Operation
      2. 9.1.2 Multiple Devices, Parallel Connection
      3. 9.1.3 Multiple eFuses, Parallel Connection With PMBus
      4. 9.1.4 Digital Telemetry Using External Microcontroller
    2. 9.2 Typical Application: 12-V, 3.3-kW Power Path Protection in Data Center Servers
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient Protection
      2. 9.4.2 Output short-Circuit Measurements
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

9.2.4 Application Curves

All the waveforms below are captured on an evaluation setup with six (6) TPS25984 eFuses in parallel. All the pullup supplies are derived from a separate standby rail.

GUID-566B0156-3754-4A8A-B2EB-C4C2A2CE6E62-low.svgFigure 9-6 Input Hot Plug: VIN Stepped Up from 0 V to 12 V, CLOAD = 50 mF, CDVDT = 33 nF, and RILIM on Each Device = 442 Ω
GUID-70E4C527-0D66-40DC-868E-9CD989B57B9A-low.svgFigure 9-8 Power Up into Short: VIN = 12 V, EN/UVLO Stepped Up From 0 V to 3 V, RIREF = 40.2 kΩ, RILIM on Each Device = 442 Ω, and OUT Shorted to GND
GUID-91E45030-3833-4A8D-8303-DC83626669C3-low.svgFigure 9-10 Circuit-Breaker Response: VIN = 12 V, CITIMER = 22 nF, CLOAD = 50 mF, RIMON = 200 Ω, RIREF = 40.2 kΩ, and Load Current Stepped up From 250 A to 400 A for > 20 ms
GUID-20230718-SS0I-TWMG-TRPK-09LPXH7S0HXM-low.svgFigure 9-12 Two Devices in Parallel Temperature Rise with 110-A DC Current at Room Temperature (No Air-Flow)
GUID-8E3AC423-6590-412E-B08E-614B1A180B74-low.svgFigure 9-7 Start-up with EN/UVLO: VIN = 12 V, EN/UVLO Stepped Up From 0 V to 3 V, CLOAD = 50 mF, RLOAD(Start-up) = 0.48 Ω, CDVDT = 33 nF, and RILIM on Each Device = 442 Ω
GUID-4A4AED6B-9AEE-4C7E-AAF6-A7541B06AB67-low.svgFigure 9-9 Transient Overload: VIN = 12 V, CITIMER = 22 nF, CLOAD = 50 mF, RIMON = 200 Ω, RIREF = 40.2 kΩ, and Load Current Stepped from 250 A to 300 A then 250 A within 10 ms
GUID-B7DADB65-D7D6-40B4-87E5-BCCDA8C24F30-low.svgFigure 9-11 Output Hot-Short Response: VIN = 12 V, RIMON = 200 Ω, RIREF = 40.2 kΩ, and OUT Shorted to GND