ZHCSTG6A
July 2023 – October 2023
TPS25984
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Logic Interface
7.7
Timing Requirements
7.8
Switching Characteristics
7.9
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Undervoltage Protection
8.3.2
Insertion Delay
8.3.3
Overvoltage Protection
8.3.4
Inrush Current, Overcurrent, and Short-Circuit Protection
8.3.4.1
Slew Rate (dVdt) and Inrush Current Control
8.3.4.1.1
Start-Up Time Out
8.3.4.2
Steady-State Overcurrent Protection (Circuit-Breaker)
8.3.4.3
Active Current Limiting During Start-Up
8.3.4.4
Short-Circuit Protection
8.3.5
Analog Load Current Monitor (IMON)
8.3.6
Mode Selection (MODE)
8.3.7
Parallel Device Synchronization (SWEN)
8.3.8
Stacking Multiple eFuses for Unlimited Scalability
8.3.8.1
Current Balancing During Start-Up
8.3.9
Analog Junction Temperature Monitor (TEMP)
8.3.10
Overtemperature Protection
8.3.11
Fault Response and Indication (FLT)
8.3.12
Power-Good Indication (PG)
8.3.13
Output Discharge
8.3.14
FET Health Monitoring
8.3.15
Single Point Failure Mitigation
8.3.15.1
IMON Pin Single Point Failure
8.3.15.2
ILIM Pin Single Point Failure
8.3.15.3
IREF Pin Single Point Failure
8.3.15.4
ITIMER Pin Single Point Failure
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.1.1
Single Device, Standalone Operation
9.1.2
Multiple Devices, Parallel Connection
9.1.3
Multiple eFuses, Parallel Connection With PMBus
9.1.4
Digital Telemetry Using External Microcontroller
9.2
Typical Application: 12-V, 3.3-kW Power Path Protection in Data Center Servers
9.2.1
Application
9.2.2
Design Requirements
9.2.3
Detailed Design Procedure
9.2.4
Application Curves
9.3
Best Design Practices
9.4
Power Supply Recommendations
9.4.1
Transient Protection
9.4.2
Output short-Circuit Measurements
9.5
Layout
9.5.1
Layout Guidelines
9.5.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
支持资源
10.3
Trademarks
10.4
静电放电警告
10.5
术语表
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RZJ|32
MPQF664A
散热焊盘机械数据 (封装 | 引脚)
RZJ|32
QFND783
10.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。