ZHCSQ76 December   2022 TPS25961

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 典型特性
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 欠压保护 (UVP) 和欠压锁定 (UVLO)
      2. 7.3.2 Overvoltage Protection
      3. 7.3.3 Inrush Current, Overcurrent and Short Circuit Protection
        1. 7.3.3.1 Slew Rate and Inrush Current Control (dVdt)
        2. 7.3.3.2 Active Current Limiting
        3. 7.3.3.3 Short-Circuit Protection
      4. 7.3.4 Overtemperature Protection (OTP)
      5. 7.3.5 Fault Response
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 典型应用
      1. 8.2.1 Adapter input protection for set-top boxes
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Programming the Current-Limit Threshold: RILM Selection
        2. 8.2.3.2 欠压和过压锁定设定点
        3. 8.2.3.3 Output Voltage Rise Time (tR)
      4. 8.2.4 Application Curves
    3. 8.3 Application Example
      1. 8.3.1 Application Curves
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 瞬态保护
      2. 8.4.2 Output Short-Circuit Measurements
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 商标
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

支持资源

TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅 TI 的《使用条款》