ZHCSO53G August   2010  – June 2021 TPD2EUSB30 , TPD2EUSB30A , TPD4EUSB30

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range on D+, D- Pins
        2. 8.2.2.2 Operating Frequency
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TPD2EUSB30TPD2EUSB30ATPD4EUSB30UNIT
DRT (SOT)DRT (SOT)DQA (USON)
3 PINS3 PINS10 PINS
RθJAJunction-to-ambient thermal resistance610.2610.2162.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance288.0288.0128.3°C/W
RθJBJunction-to-board thermal resistance118.4118.456.7°C/W
ψJTJunction-to-top characterization parameter20.220.213.8°C/W
ψJBJunction-to-board characterization parameter116.4116.456.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A8.1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.