ZHCSAA3B September   2012  – September 2015 TPA3112D1-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Characteristics
    6. 6.6 DC Characteristics
    7. 6.7 AC Characteristics
    8. 6.8 AC Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DC Detect
      2. 7.3.2 Short-Circuit Protection and Automatic Recovery Feature
      3. 7.3.3 Thermal Protection
      4. 7.3.4 GVDD Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 Gain Setting Through GAIN0 and GAIN1 Inputs
      2. 7.4.2 SD Operation
      3. 7.4.3 PLIMIT
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Class-D Operation
        2. 8.2.2.2  TPA3112D1-Q1 Modulation Scheme
        3. 8.2.2.3  Ferrite Bead Filter Considerations
        4. 8.2.2.4  Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
        5. 8.2.2.5  When to Use an Output Filter for EMI Suppression
        6. 8.2.2.6  Input Resistance
        7. 8.2.2.7  Input Capacitor, CI
        8. 8.2.2.8  BSN and BSP Capacitors
        9. 8.2.2.9  Differential Inputs
        10. 8.2.2.10 Using Low-ESR Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 开发支持

TI PCB 热量计算器

11.2 文档支持

11.2.1 相关文档

《TPA3111D1 的高电压引脚上的最大转换率》，SLUA626

《四方扁平无引线逻辑封装》 ，SCBA017

《QFN/SON PCB 连接》，SLUA217

《PowerPAD ™ 热增强型封装》，SLMA002

《半导体和 IC 封装热指标》，SPRA953

《TPA3112D1EVM 音频放大器评估板》，SLOU272

11.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 商标

SpeakerGuard, PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.