ZHCSQZ0A August   2022  – November 2022 TMUXHS221

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  High-Speed Performance Parameters
    7. 6.7  Switching Characteristics
    8. 6.8  Typical Characteristics – S-Parameters
    9. 6.9  Typical Characteristics – Eye Diagrams
    10.     16
    11. 6.10 Typical Characteristics – RON
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable and Power Savings
      2. 7.3.2 Data Line Biasing
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Routing Debug Signals to USB Port
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Systems Examples
      1. 8.3.1 PCIe Clock Muxing
      2. 8.3.2 USB-C SBU Muxing
      3. 8.3.3 Switching USB Port
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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6.10 Typical Characteristics – RON

Figure 6-7, Figure 6-8, and Figure 6-9 show switch ON resistance RON versus common mode voltage VCM, supply voltage VCC, and ambient temperature respectively. All curves are at nominal PVT conditions unless specified.

Figure 6-7 RON vs Common Mode Voltage VCM
Figure 6-9 RON vs Ambient Temperature
Figure 6-8 RON vs Supply Voltage VCC