ZHCSQ93B
March 2022 – December 2023
TMUX7236
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Thermal Information
5.4
Recommended Operating Conditions
5.5
Source or Drain Continuous Current
5.6
±15 V Dual Supply: Electrical Characteristics
5.7
±15 V Dual Supply: Switching Characteristics
5.8
±20 V Dual Supply: Electrical Characteristics
5.9
±20 V Dual Supply: Switching Characteristics
5.10
44 V Single Supply: Electrical Characteristics
5.11
44 V Single Supply: Switching Characteristics
5.12
12 V Single Supply: Electrical Characteristics
5.13
12 V Single Supply: Switching Characteristics
5.14
Typical Characteristics
6
Parameter Measurement Information
6.1
On-Resistance
6.2
Off-Leakage Current
6.3
On-Leakage Current
6.4
Transition Time
6.5
tON(EN) and tOFF(EN)
6.6
Break-Before-Make
6.7
tON (VDD) Time
6.8
Propagation Delay
6.9
Charge Injection
6.10
Off Isolation
6.11
Crosstalk
6.12
Bandwidth
6.13
THD + Noise
6.14
Power Supply Rejection Ratio (PSRR)
7
Detailed Description
7.1
Functional Block Diagram
7.2
Feature Description
7.2.1
Bidirectional Operation
7.2.2
Rail to Rail Operation
7.2.3
1.8 V Logic Compatible Inputs
7.2.4
Integrated Pull-Down Resistor on Logic Pins
7.2.5
Fail-Safe Logic
7.2.6
Latch-Up Immune
7.2.7
Ultra-Low Charge Injection
7.3
Device Functional Modes
7.4
Truth Tables
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.2.3.1
On-Resistance Mismatch Between Channels
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
术语表
9.6
静电放电警告
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
PW|16
RUM|16
散热焊盘机械数据 (封装 | 引脚)
RUM|16
QFND679
订购信息
zhcsq93b_oa
zhcsq93b_pm
9.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。