ZHCSQR8A
March 2023 – December 2023
TMAG5170D-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Magnetic Characteristics
5.7
Power up Timing
5.8
SPI Interface Timing
5.9
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Magnetic Flux Direction
6.3.2
Sensor Location
6.3.3
Magnetic Range Selection
6.3.4
Update Rate Settings
6.3.5
ALERT Function
6.3.5.1
Interrupt and Trigger Mode
6.3.5.2
Magnetic Switch Mode
6.3.6
Threshold Count
6.3.7
Diagnostics
6.3.7.1
Memory Cyclic Redundancy Check (CRC)
6.3.7.2
ALERT Integrity Check
6.3.7.3
VCC Check
6.3.7.4
Internal LDO Undervoltage Check
6.3.7.5
Digital Core Power-On Reset Check
6.3.7.6
SDO Output Check
6.3.7.7
Communication Cyclic Redundancy Check (CRC)
6.3.7.8
Oscillator Integrity Check
6.3.7.9
Magnetic Field Threshold Check
6.3.7.10
Temperature Alert Check
6.3.7.11
Analog Front-End (AFE) Check
6.3.7.12
Hall Resistance and Switch Matrix Check
6.3.7.13
Hall Offset Check
6.3.7.14
ADC Check
6.4
Device Functional Modes
6.4.1
Operating Modes
6.4.1.1
Active Mode
6.4.1.2
Standby Mode
6.4.1.3
Configuration Mode (DEFAULT)
6.4.1.4
Sleep Mode
6.4.1.5
Wake-Up and Sleep Mode
6.4.1.6
Deep-Sleep Mode
6.5
Programming
6.5.1
Data Definition
6.5.1.1
Magnetic Sensor Data
6.5.1.2
Temperature Sensor Data
6.5.1.3
Magnetic Sensor Offset Correction
6.5.1.4
Angle and Magnitude Data Definition
6.5.2
Serial Peripheral Interface (SPI)
6.5.2.1
SCK
6.5.2.2
CS
6.5.2.3
SDI
6.5.2.4
SDO
6.5.2.4.1
Regular 32-Bit SDO Read
6.5.2.4.2
Special 32-Bit SDO Read
6.5.2.5
SPI CRC
6.5.2.6
SPI Frame
6.5.2.6.1
32-Bit Read Frame
6.5.2.6.2
32-Bit Write Frame
7
Application and Implementation
7.1
Application Information
7.1.1
Selecting the Sensitivity Option
7.1.2
Temperature Compensation for Magnets
7.1.3
Sensor Conversion
7.1.3.1
Continuous Conversion
7.1.3.2
Trigger Conversion
7.1.3.3
Pseudo-Simultaneous Sampling
7.1.4
Error Calculation During Linear Measurement
7.1.5
Error Calculation During Angular Measurement
7.2
Typical Application
7.2.1
Design Requirements
7.2.1.1
Gain Adjustment for Angle Measurement
7.2.2
Detailed Design Procedure
7.2.3
Application Curves
7.3
Best Design Practices
7.4
Power Supply Recommendations
7.5
Layout
7.5.1
Layout Guidelines
7.5.2
Layout Example
8
Register Map
9
Device and Documentation Support
9.1
接收文档更新通知
9.2
支持资源
9.3
Trademarks
9.4
静电放电警告
9.5
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
PW|16
MPDS361A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsqr8a_oa
zhcsqr8a_pm
9.5
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。