ZHCSH76C October 2017 – March 2024 TLV757P
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
PCB | THERMAL METRIC(1) (2) | TLV757 | UNIT | |||
---|---|---|---|---|---|---|
DYD (SOT-23) | DBV (SOT-23) | DRV (SON) | ||||
5 PINS | 5 PINS | 6 PINS | ||||
EVM | RθJA | Junction-to-ambient thermal resistance | 60.3 | 100.8 | N/A | °C/W |
ψJT | Junction-to-top characterization parameter | 14.2 | 23.3 | N/A | °C/W | |
ψJB | Junction-to-board characterization parameter | 35.9 | 67.8 | N/A | °C/W | |
JEDEC | RθJA | Junction-to-ambient thermal resistance | 92.5 | 231.1 | 100.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 119.8 | 118.4 | 108.5 | °C/W | |
RθJB | Junction-to-board thermal resistance | 45.8 | 64.4 | 64.3 | °C/W | |
ψJT | Junction-to-top characterization parameter | 16.7 | 28.4 | 10.4 | °C/W | |
ψJB | Junction-to-board characterization parameter | 44.9 | 63.8 | 64.8 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 34.3 | N/A | 34.7 | °C/W |