ZHCSI89C November   2017  – March 2024 TLV755P

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Enable (EN)
      3. 6.3.3 Internal Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Selection
      2. 7.1.2 Dropout Voltage
      3. 7.1.3 Exiting Dropout
      4. 7.1.4 Reverse Current
      5. 7.1.5 Power Dissipation (PD)
        1. 7.1.5.1 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Current
        2. 7.2.2.2 Thermal Dissipation
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DYD|5
  • DBV|5
  • DQN|4
  • DRV|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.1.5 Power Dissipation (PD)

Circuit reliability demands that proper consideration be given to device power dissipation, location of the circuit on the printed circuit board (PCB), and correct sizing of the thermal plane. Make sure the PCB area around the regulator is as free of other heat-generating devices as possible that cause added thermal stresses.

As a first-order approximation, power dissipation in the regulator depends on the input-to-output voltage difference and load conditions. Use Equation 2 to approximate PD:

Equation 2. PD = (VIN – VOUT) × IOUT

Minimize power dissipation to achieve greater efficiency. This minimizing process is achieved by selecting the correct system voltage rails. Proper selection helps obtain the minimum input-to-output voltage differential. The low dropout of the device allows for maximum efficiency across a wide range of output voltages.

The main heat-conduction path for the device is through the thermal pad on the package. As such, solder the thermal pad to a copper pad area under the device. This pad area contains an array of plated vias that conduct heat to inner plane areas or to a bottom-side copper plane.

The maximum allowable junction temperature (TJ) determines the maximum power dissipation for the device. According to Equation 3, power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance (RθJA) of the combined PCB, device package, and the temperature of the ambient air (TA).

Equation 3. TJ = TA + RθJA × PD

Unfortunately, this thermal resistance (RθJA) is dependent on the heat-spreading capability built into the particular PCB design, and therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA value is only used as a relative measure of package thermal performance. RθJA is the sum of the package junction-to-case (bottom) thermal resistance (RθJCbot) plus the thermal resistance contribution by the PCB copper.