SLVSLE3 May   2026 TLV4825

ADVANCE INFORMATION  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information for Single Channel
   5. 5.5 Thermal Information for Dual Channel
   6. 5.6 Thermal Information for Quad Channel
   7. 5.7 Electrical Characteristics
   8. 5.8 Typical Characteristics
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Operating Voltage
      2. 6.3.2 Input Common-Mode Range
      3. 6.3.3 Output Range
      4. 6.3.4 Capacitive Load and Stability
      5. 6.3.5 Overload Recovery
      6. 6.3.6 Phase-Reversal Protection
      7. 6.3.7 Chopping Transients
      8. 6.3.8 EMI Rejection
      9. 6.3.9 Electrical Overstress
   4. 6.4 Device Functional Modes
8. 7 Application and Implementation
   1. 7.1 Application Information
      1. 7.1.1 Basic Noise Calculations
   2. 7.2 Typical Application
      1. 7.2.1 TLVx825 in Low-Side, Current Sensing Application
         1. 7.2.1.1 Design Requirements
         2. 7.2.1.2 Detailed Design Procedure
         3. 7.2.1.3 Application Curve
   3. 7.3 Power Supply Recommendations
   4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Device Support
      1. 8.1.1 Development Support
         1. 8.1.1.1 PSpice® for TI
         2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
   2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
   3. 8.3 Receiving Notification of Documentation Updates
   4. 8.4 Support Resources
   5. 8.5 Trademarks
   6. 8.6 Electrostatic Discharge Caution
   7. 8.7 Glossary
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data
    2. 10.2 Tape and Reel Information