ZHCSJ63 December   2018 TLV1805

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      采用 P 沟道 MOSFET 的过压保护
      2.      采用 P 沟道 MOSFET 的反向电流和过压保护
  4. 4 修订历史记录
  5. 5 说明 (续)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail to Rail Inputs
      2. 8.3.2 Power On Reset
      3. 8.3.3 High Power Push-Pull Output
      4. 8.3.4 Shutdown Function
      5. 8.3.5 Internal Hysteresis
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Hysteresis
        1. 8.4.1.1 Inverting Comparator With Hysteresis
        2. 8.4.1.2 Noninverting Comparator With Hysteresis
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
      4. 9.2.4 Reverse Current Protection Using MOSFET and TLV1805
        1. 9.2.4.1 Minimum Reverse Current
        2. 9.2.4.2 N-Channel Reverse Current Protection Circuit
          1. 9.2.4.2.1 N-Channel Oscillator Circuit
      5. 9.2.5 P-Channel Reverse Current Protection Circuit
      6. 9.2.6 P-Channel Reverse Current Protection With Overvotlage Protection
      7. 9.2.7 ORing MOSFET Controller
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.1 Layout Guidelines

Comparators are very sensitive to input noise. For best results, maintain the following layout guidelines:

  • Use a printed circuit board (PCB) with a good, unbroken low-inductance ground plane. Proper grounding (use of ground plane) helps maintain specified performance of the TLV1805 family of devices.
  • To minimize supply noise, place a decoupling capacitor (0.1-μF ceramic, surface-mount capacitor) as close as possible to VS as shown in Figure 73.
  • On the inputs and the output, keep lead lengths as short as possible to avoid unwanted parasitic feedback around the comparator. Keep inputs away from the output.
  • Solder the device directly to the PCB rather than using a socket.
  • Run the ground pin ground trace under the device up to the bypass capacitor, shielding the inputs from the outputs.