ZHCSKP3J February 2019 – August 2021 TDA4VM , TDA4VM-Q1
PRODUCTION DATA
The terms "ball", "pin", and "terminal" are used interchangeably throughout the document. An attempt is made to use "ball" only when referring to the physical package.
Figure 6-1 shows the ball locations for the 827-ball flip chip ball grid array (FCBGA) package that are used in conjunction with Table 6-1 Figure 6-1through Figure 6-1 to locate signal names and ball grid numbers.