ZHCSEL0D February   2016  – October 2021 TCAN1042-Q1 , TCAN1042G-Q1 , TCAN1042GV-Q1 , TCAN1042H-Q1 , TCAN1042HG-Q1 , TCAN1042HGV-Q1 , TCAN1042HV-Q1 , TCAN1042V-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, Specifications
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Rating
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 Devices with VCC Only (Devices without the "V" Suffix):
        2. 9.3.7.2 Devices with VIO I/O Level Shifting (Devices with "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (March 2019) to Revision D (October 2021)

  • 添加了特性：EMC 性能：..Go
  • 添加了特性 “提供功能安全型”Go
  • 更改了汽车特性，删除了温度和分类等级Go
  • Deleted "Product Preview" from the DRB pin images in the Pin Configurations and Functions Go
  • Added footnote to the GND pin in the Pin Functions table Go
  • Changed the ESD Ratings table, added HBM and CDM classification levelsGo
  • Changed the DRB (VSON) values in the Thermal Information table Go
  • Changed the title in Section 9.3.7.1 Go
  • Changed the title in Section 9.3.7.2 Go

Changes from Revision B (May 2017) to Revision C (March 2019)

  • Changed the ICC MAX value From: 180 mA To: 110 mA in the Electrical Characteristics Go
  • Changed the tWK_FILTER MAX value From: 1.85 µs To: 1.8 µs in the Switching Characteristics Go

Changes from Revision A (May 2016) to Revision B (May 2017)

  • 将特性 “符合发布的 ISO 11898-2:2007 和 ISO 11898-2:2003 物理层标准”更改为“符合 ISO 11898-2:2016 和 ISO 11898-5:2007 物理层标准”Go
  • 删除了特性：符合 2015 年 12 月 17 日发布的 ISO 11898-2 物理层更新草案Go
  • 将“特性”从“所有器件均支持 2Mbps CAN FD..”更改为“所有器件均支持经典 CAN 和 2Mbps CAN FD..”Go
  • 添加了特性 “可采用 SOIC(8) 封装和无引线 VSON(8) 封装...”Go
  • 将应用 从“重型机械 ISO11783”更改为“重型机械 ISOBUS 应用 – ISO 11783”Go
  • 更改了应用 列表Go
  • 将特性 从“EMC：SAE J2962、GIFT/ICT、ISO 16845”更改为“符合 SAE J2962、GIFT/ICT、ISO16845 的要求”Go
  • Added new devices to the Device Comparison Table Go
  • Added Storage temperature range to the Section 7.1 tableGo
  • Changed the ESD Ratings table to show the D(SOIC) and DRB (VSON) valuesGo
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD Ratings tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD Ratings tableGo
  • Added the DRB package to the Thermal Information table Go
  • Added the Power Rating table Go
  • Changed VSYM in the Driver Electrical Characteristics tableGo
  • Changed VSYM_DC in the Driver Electrical Characteristics tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the Receiver Electrical Characteristics tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" in the Test Condition of CID in the Receiver Electrical Characteristics tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the Receiver Electrical Characteristics tableGo
  • Changed the tMODE TYP value From: 1 µs To: 9 µS in the Switching Characteristics tableGo
  • Added Note 2 and Changed Table 9-2, BUS OUTPUT columGo
  • Changed Section 9.4.3 section Go

Changes from Revision * (March 2016) to Revision A (May 2016)

  • 添加了特性 “符合发布的 ISO 11898-2:2007 和 ISO 11898-2:2003 物理层标准”Go
  • 将特性 从“符合 ISO11898-2 (2016) 标准的要求”更改为“符合 2015 年 12 月 17 日发布的 ISO 11898-2 物理层更新草案”Go
  • 更改了应用 列表Go
  • 向器件信息 表中添加了 VSON (8) 引脚封装Go
  • Added the VSON (8) pin package to the Pin Configuration and Functions Go
  • Added V(Diff) to the Section 7.1 table Go
  • Changed OTP to TSD in the Functional Block Diagram Go
  • Added Note 2 to Table 9-1 Go
  • Added Note 1 to Table 9-2 Go
  • Added pin number to the Section 12.2 image Go