ZHCSLQ0B August   2020  – November 2023 TCA4307

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hot bus insertion
      2. 7.3.2 Pre-charge voltage
      3. 7.3.3 Rise time accelerators
      4. 7.3.4 Bus ready output indicator
      5. 7.3.5 Powered-off high impedance for I2C and I/O pins
      6. 7.3.6 Supports clock stretching and arbitration
      7. 7.3.7 Stuck bus recovery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-up and precharge
      2. 7.4.2 Bus idle
      3. 7.4.3 Bus active
      4. 7.4.4 Bus stuck
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Series connections
        2. 8.2.1.2 Multiple connections to a common node
        3. 8.2.1.3 Propagation delays
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application on a Backplane
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Best Practices
      2. 8.3.2 Power-on Reset Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision A (October 2023) to Revision B (November 2023)

  • 删除了封装信息 表中 DGR 封装的“产品预发布”说明Go

Changes from Revision * (August 2020) to Revision A (October 2023)

  • 将提到 I2C 的旧术语实例通篇更改为控制器和目标Go
  • 向封装信息 表中添加了 DRG 封装Go
  • Added DRG to the Thermal Information tableGo