ZHCSVF8C January   1977  – March 2024 SN75158

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7.   Parameter Measuremrnt Information
  8. 6Device and Documentation Support
    1. 6.1 接收文档更新通知
    2. 6.2 支持资源
    3. 6.3 商标
    4. 6.4 静电放电警告
    5. 6.5 术语表
  9. 7Revision History
  10. 8Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
  • PS|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)DPPSUNIT
8-Pins
R θJAJunction-to-ambient thermal resistance 116.784.389.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance56.365.446.2°C/W
R θJBJunction-to-board thermal resistance 63.462.150.7°C/W
ψ JTJunction-to-top characterization parameter 8.831.323.5°C/W
ψ JBJunction-to-board characterization parameter 62.660.460.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance N/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.