ZHCSRC6Q November   1996  – December 2022 SN74LVCC3245A

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 A Port (VCCA = 2.5 V ± 0.2 V and VCCB = 3.3 V ± 0.3 V)
    2. 7.2 B Port (VCCA = 2.5 V ± 0.2 V and VCCB = 3.3 V ± 0.3 V)
    3. 7.3 B Port (VCCA = 3.6 V and VCCB = 5.5 V)
    4. 7.4 A and B Port (VCCA and VCCB = 3.6 V)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1.      Application and Implementation
        1. 9.1 Application Information
        2. 9.2 Typical Application
          1. 9.2.1 Design Requirements
          2. 9.2.2 Detailed Design Procedure
          3. 9.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power-Up Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBQ|24
  • NS|24
  • DW|24
  • DB|24
  • PW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.3 Power-Up Considerations

TI level-translation devices offer an opportunity for successful mixed-voltage signal design. A proper power-up sequence always should be followed to avoid excessive supply current, bus contention, oscillations, or other anomalies caused by improperly biased device terminals. To guard against such power-up problems, take these precautions:

  1. Connect ground before any supply voltage is applied.
  2. Power up the control side of the device (VCCA for all four of these devices).
  3. Tie OE to VCCA with a pullup resistor so that it ramps with VCCA.
  4. Depending on the direction of the data path, DIR can be high or low. If DIR high is needed (A data to B bus), ramp it with VCCA. Otherwise, keep DIR low.

For more information, refer to Voltage-Level-Translation Devices application note.