SLVSJB2 July   2025 SN74LV8T374

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Noise Characteristics
    7. 5.7 Timing Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Latching Logic with Known Power-Up State
      3. 7.3.3 LVxT Enhanced Input Voltage
        1. 7.3.3.1 Up Translation
        2. 7.3.3.2 Down Translation
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

SN74LV8T374 SN74LV8T374
            RKS Package (Top View)Figure 4-1 SN74LV8T374 RKS Package (Top View)
SN74LV8T374 SN74LV8T374
            PW, DGS Package (Top View)Figure 4-2 SN74LV8T374 PW, DGS Package (Top View)
Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
OE 1 I Output enable, active low
1Q 2 O Output for channel 1
1D 3 I Input for channel 1
2D 4 I Input for channel 2
2Q 5 O Output for channel 2
3Q 6 O Output for channel 3
3D 7 I Input for channel 3
4D 8 I Input for channel 4
4Q 9 O Output for channel 4
CLK 10 G Clock input
LE 11 I Latch enable
5Q 12 O Output for channel 5
5D 13 I Input for channel 5
6D 14 I Input for channel 6
6Q 15 O Output for channel 6
7Q 16 O Output for channel 7
7D 17 I Input for channel 7
8D 18 I Input for channel 8
8Q 19 O Output for channel 8
VCC 20 P Postive supply
Thermal Pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
Signal Types: I = Input, O = Output, G = Ground, P = Power.
RKS package only.