SLVSJB2 July   2025 SN74LV8T374

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Noise Characteristics
    7. 5.7 Timing Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Latching Logic with Known Power-Up State
      3. 7.3.3 LVxT Enhanced Input Voltage
        1. 7.3.3.1 Up Translation
        2. 7.3.3.2 Down Translation
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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8.4.1 Layout Guidelines

  • Bypass capacitor placement
    • Place near the positive supply terminal of the device
    • Provide an electrically short ground return path
    • Use wide traces to minimize impedance
    • Keep the device, capacitors, and traces on the same side of the board whenever possible
  • Signal trace geometry
    • 8mil to 12mil trace width
    • Lengths less than 12cm to minimize transmission line effects
    • Avoid 90° corners for signal traces
    • Use an unbroken ground plane below signal traces
    • Flood fill areas around signal traces with ground
    • Parallel traces must be separated by at least 3x dielectric thickness
    • For traces longer than 12cm
      • Use impedance controlled traces
      • Source-terminate using a series damping resistor near the output
      • Avoid branches; buffer each signal that must branch separately