ZHCSMQ8E june   2006  – october 2020 SN65LVDS302

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Input Electrical Characteristics
    7. 6.7  Output Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Device Power Dissipation
    11.     Typical Characteristics
  8. 7 Parameter Measurement Information
    1.     20
    2. 7.1 Power Consumption Tests
    3. 7.2 Typical IC Power Consumption Test Pattern
    4. 7.3 Maximum Power Consumption Test Pattern
    5. 7.4 Output Skew Pulse Position and Jitter Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Swap Pin Functionality
      2. 8.3.2 Parity Error Detection and Handling
    4. 8.4 Device Functional Modes
      1. 8.4.1 Deserialization Modes
        1. 8.4.1.1 1-Channel Mode
        2. 8.4.1.2 2-Channel Mode
        3. 8.4.1.3 3-Channel Mode
      2. 8.4.2 Powerdown Modes
        1. 8.4.2.1 Shutdown Mode
        2. 8.4.2.2 Standby Mode
      3. 8.4.3 Active Modes
        1. 8.4.3.1 Acquire Mode (PLL Approaches Lock)
        2. 8.4.3.2 Receive Mode
      4. 8.4.4 Status Detect and Operating Modes Flow
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Application Information
      2. 9.1.2 Preventing Increased Leakage Currents in Control Inputs
      3. 9.1.3 Calculation Example: HVGA Display
      4. 9.1.4 How to Determine Interconnect Skew and Jitter Budget
      5. 9.1.5 F/S Pin Setting and Connecting the SN65LVDS302 to an LCD Driver
      6. 9.1.6 How to Determine the LCD Driver Timing Margin
      7. 9.1.7 Typical Application Frequencies
    2. 9.2 Typical Applications
      1. 9.2.1 VGA Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Power-Up and Power-Down Sequences
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual LCD-Display Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
  13. 12Device and Documentation Support
    1. 12.1 Community Resource
    2. 12.2 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

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订购信息

6.4 Thermal Information

THERMAL METRIC(1)SN65LVDS302UNIT
ZXH
(nFBGA)
80 PINS
RθJAJunction-to-ambient thermal resistance41.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance29.4°C/W
RθJBJunction-to-board thermal resistance23.8°C/W
ψJTJunction-to-top characterization parameter0.5°C/W
ψJBJunction-to-board characterization parameter23.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.