ZHCSPJ9B February   2022  – December 2023 SN54SLC8T245-SEP

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7 V
    7. 5.7  Switching Characteristics, VCCA = 0.8 V
    8. 5.8  Switching Characteristics, VCCA = 0.9 V
    9. 5.9  Switching Characteristics, VCCA = 1.2 V
    10. 5.10 Switching Characteristics, VCCA = 1.5 V
    11. 5.11 Switching Characteristics, VCCA = 1.8 V
    12. 5.12 Switching Characteristics, VCCA = 2.5 V
    13. 5.13 Switching Characteristics, VCCA = 3.3 V
    14. 5.14 Operating Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Up-Translation and Down-Translation From 0.65 V to 3.6 V
      2. 7.3.2 Multiple Direction Control Pins
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Supply Recommendations

Always apply a ground reference to the GND pins first. There are no additional requirements for power supply sequencing.

This device was designed with various power supply sequencing methods in mind to help prevent unintended triggering of downstream devices. For more information regarding the power up glitch performance of level translators, see the Power Sequencing for AXC Family of Devices application report.