ZHCSGP3D September   2017  – December 2018 OPA2837 , OPA837

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
    1.     具有真正接地输入和输出范围的低功耗、低噪声、精密单端 SAR ADC 驱动器
  3. 3 说明
    1.     Device Images
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: OPA837
    5. 6.5  Thermal Information: OPA2837
    6. 6.6  Electrical Characteristics: VS = 5 V
    7. 6.7  Electrical Characteristics: VS = 3 V
    8. 6.8  Typical Characteristics: VS = 5.0 V
    9. 6.9  Typical Characteristics: VS = 3.0 V
    10. 6.10 Typical Characteristics: ±2.5-V to ±1.5-V Split Supply
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 OPA837 Comparison
      2. 7.3.2 Input Common-Mode Voltage Range
      3. 7.3.3 Output Voltage Range
      4. 7.3.4 Power-Down Operation
      5. 7.3.5 Low-Power Applications and the Effects of Resistor Values on Bandwidth
      6. 7.3.6 Driving Capacitive Loads
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±1.35 V to ±2.7 V)
      2. 7.4.2 Single-Supply Operation (2.7 V to 5.4 V)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Noninverting Amplifier
      2. 8.1.2  Inverting Amplifier
      3. 8.1.3  Output DC Error Calculations
      4. 8.1.4  Output Noise Calculations
      5. 8.1.5  Instrumentation Amplifier
      6. 8.1.6  Attenuators
      7. 8.1.7  Differential to Single-Ended Amplifier
      8. 8.1.8  Differential-to-Differential Amplifier
      9. 8.1.9  Pulse Application With Single-Supply Circuit
      10. 8.1.10 ADC Driver Performance
    2. 8.2 Typical Applications
      1. 8.2.1 Active Filters
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Implementing a 2:1 Active Multiplexer
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 1-Bit PGA Operation
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 相关链接
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information: OPA837

THERMAL METRIC(1) OPA837 UNIT
DBV
(SOT23-6)		 DCK
(SC70)
6 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 194 203 °C/W
RθJCtop Junction-to-case (top) thermal resistance 129 152 °C/W
RθJB Junction-to-board thermal resistance 39 76 °C/W
ψJT Junction-to-top characterization parameter 26 58 °C/W
ψJB Junction-to-board characterization parameter 39 76 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.