ZHCSKM1D October 1997 – December 2019 OPA548
PRODUCTION DATA.
Power dissipated in the OPA548 will cause the junction temperature to rise. The OPA548 has thermal shutdown circuitry that protects the amplifier from damage. The thermal protection circuitry disables the output when the junction temperature reaches approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again enabled. Depending on load and signal conditions, the thermal protection circuit may cycle on and off. This limits the dissipation of the amplifier but may have an undesirable effect on the load.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink. For reliable operation, junction temperature should be limited to 125°C, maximum. To estimate the margin of safety in a complete design (including heat sink) increase the ambient temperature until the thermal protection is triggered. Use worst-case load and signal conditions. For good reliability, thermal protection should trigger more than 35°C more than the maximum expected ambient condition of your application. This produces a junction temperature of 125°C at the maximum expected ambient condition.
The internal protection circuitry of the OPA548 was designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the OPA548 into thermal shutdown will degrade reliability.