ZHCSKM1D October   1997  – December 2019 OPA548

PRODUCTION DATA.  

  1. 特性
  2. 应用
    1.     简化电路原理图
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
      2. 7.3.2 Enable/Status (E/S) Pin
      3. 7.3.3 Thermal Shutdown Status
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Disable
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Basic Circuit Connections
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Power Supply Requirements
          2. 8.2.1.2.2 Gain Setting and Input Configuration
          3. 8.2.1.2.3 Current Limit
          4. 8.2.1.2.4 Safe-Operating-Area
          5. 8.2.1.2.5 Heat Sinking
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Monitoring Single- and Dual-Supplies
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Disable and Thermal Shutdown Status
      3. 8.2.3 Programmable Power Supply
    3. 8.3 System Examples
  9. Power Supply Recommendations
    1. 9.1 Output Stage Compensation
    2. 9.2 Output Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Safe Operating Area
      2. 10.1.2 Amplifier Mounting
      3. 10.1.3 Power Dissipation
      4. 10.1.4 Thermal Considerations
      5. 10.1.5 Heat Sinking
        1. 10.1.5.1 Heat Sink Selection Example
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Overview

The OPA548 device uses a PNP input stage (resulting in negative bias currents at each input) without input bias current compensation so matched resistances on the inputs will reduce errors. After the main voltage gain stage is the high current output stage with temperature compensated class A/B biasing to reduce crossover distortion. Local feedback in the output stage may require additional compensation for highly reactive loads (see Output Stage Compensation).