ZHCSBR3C December   2013  – May 2018 OPA355-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
    1. 5.1 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Enable Function
      3. 8.3.3 Output Drive
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Transimpedance Amplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optimizing The Transimpedance Circuit
        3. 9.2.1.3 Application Curve
      2. 9.2.2 High-Impedance Sensor Interface
      3. 9.2.3 Driving ADCs
      4. 9.2.4 Active Filter
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (June 2014) to C Revision

  • Deleted "C55" marking on pinout drawing in Pin Configuration and Functions section Go
  • Added Pin Functions table to Pin Configuration and Functions section Go
  • Deleted storage temperature range from ESD Ratings table and moved to Absolute Maximum Ratings table Go
  • Changed title of Handling Ratings table to ESD Ratings table Go
  • Added Recommended Operating Conditions table Go
  • Added Functional Block Diagram Go
  • Deleted "Independent enable pins are available for each channel, which provide maximum design flexibility" from Enable Function sectionGo
  • Deleted Input and ESD Protection subsection in Feature Description sectionGo
  • Added Device Functional Modes sectionGo
  • Added Typical Applications section to Application and Implementation section Go
  • Added Design Requirements subsection to Typical Applications section Go
  • Added Detailed Design Procedure subsection to Typical Application section Go
  • Added application curves to the Typical Application section Go
  • Added High-Impedance Sensor Interface, Driving ADCs, and Active Filter subsections to Typical Application sectionGo
  • Added Power Supply Recommendations section Go
  • Added layout example image to Layout sectionGo

Changes from A Revision (December 2013) to B Revision

  • Changed 器件状态从 产品预览 更改为 量产数据Go