ZHCSMO3C June   2020  – April 2021 OPA2863 , OPA863

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA863
    5. 7.5  Thermal Information: OPA2863
    6. 7.6  Electrical Characteristics: 10 V
    7. 7.7  Electrical Characteristics: 3 V
    8. 7.8  Typical Characteristics: VS = 10 V
    9. 7.9  Typical Characteristics: VS = 3 V
    10. 7.10 Typical Characteristics: VS = 3 V to 10 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
        1. 8.3.2.1 Overload Power Limit
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
      2. 8.4.2 Split-Supply Operation (±1.35 V to ±6.3 V)
      3. 8.4.3 Single-Supply Operation (2.7 V to 12.6 V)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Amplifier Gain Configurations
    2. 9.2 Low-Side Current Sensing
      1. 9.2.1 Design Requirements
    3. 9.3 Transimpedance Amplifier
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
    4. 9.4 Low-Power SAR ADC Driver and Reference Buffer
    5. 9.5 Front-End Gain and Filtering
    6. 9.6 Clamp-On Ultrasonic Flow Meter
    7. 9.7 Variable Reference Generator Using MDAC
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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Thermal Considerations

The OPA2863 does not require heat sinking or airflow in most applications. The maximum allowed junction temperature sets the maximum allowed internal power dissipation. Do not allow the maximum junction temperature to exceed 150°C.

Operating junction temperature (TJ) is given by TA + PD × θJA. The total internal power dissipation (PD) is the sum of quiescent power (PDQ) and additional power dissipated in the output stage (PDL) to deliver load power. Quiescent power is the specified no-load supply current times the total supply voltage across the part. PDL depends on the required output signal and load, but would (for a grounded resistive load) be at a maximum when the output is fixed at a voltage equal to half of either supply voltage (for equal split-supplies). Under this condition PDL = VS2 / (4 × RL) where RL includes feedback network loading.

As a worst-case example, compute the maximum TJ using an OPA2863-DGK (VSSOP package) configured as a unity gain buffer, operating on ±6-V supplies at an ambient temperature of 25°C and driving a grounded 500-Ω load.

PD = 12 V × 2 mA + 62 /(4 × 500 Ω) = 42 mW

Maximum TJ = 25°C + (0.042 W × 180.3°C/W) = 33°C, which is well below the maximum allowed junction temperature of 150°C.