ZHCSMO3D June   2020  – July 2021 OPA2863 , OPA4863 , OPA863

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA863
    5. 7.5  Thermal Information: OPA2863
    6. 7.6  热性能信息:OPA4863
    7. 7.7  Electrical Characteristics: 10 V
    8. 7.8  Electrical Characteristics: 3 V
    9. 7.9  Typical Characteristics: VS = 10 V
    10. 7.10 Typical Characteristics: VS = 3 V
    11. 7.11 Typical Characteristics: VS = 3 V to 10 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
        1. 8.3.2.1 Overload Power Limit
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
      2. 8.4.2 Split-Supply Operation (±1.35 V to ±6.3 V)
      3. 8.4.3 Single-Supply Operation (2.7 V to 12.6 V)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Amplifier Gain Configurations
    2. 9.2 Low-Side Current Sensing
      1. 9.2.1 Design Requirements
    3. 9.3 Transimpedance Amplifier
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
    4. 9.4 Low-Power SAR ADC Driver and Reference Buffer
    5. 9.5 Front-End Gain and Filtering
    6. 9.6 Clamp-On Ultrasonic Flow Meter
    7. 9.7 Variable Reference Generator Using MDAC
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

术语表

    TI 术语表 本术语表列出并解释了术语、首字母缩略词和定义。