ZHCSDO6B May   2015  – September 2020 MSP430FG6425 , MSP430FG6426 , MSP430FG6625 , MSP430FG6626

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
    4. 7.4 Pin Multiplexing
    5. 7.5 Buffer Type
    6. 7.6 Connection of Unused Pins
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 8.6 Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    7. 8.7 Thermal Resistance Characteristics
    8. 8.8 Timing and Switching Characteristics
      1. 8.8.1  Power Supply Sequencing
        1. 8.8.1.1 Brownout and Device Reset Power Ramp Requirements
      2. 8.8.2  Reset Timing
        1. 8.8.2.1 Reset Input
      3. 8.8.3  Clock Specifications
        1. 8.8.3.1 Crystal Oscillator, XT1, Low-Frequency Mode
        2. 8.8.3.2 Crystal Oscillator, XT2
        3. 8.8.3.3 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        4. 8.8.3.4 Internal Reference, Low-Frequency Oscillator (REFO)
        5. 8.8.3.5 DCO Frequency
      4. 8.8.4  Wake-up Characteristics
        1. 8.8.4.1 Wake-up Times From Low-Power Modes and Reset
      5. 8.8.5  General-Purpose I/Os
        1. 8.8.5.1 Schmitt-Trigger Inputs – General-Purpose I/O
        2. 8.8.5.2 Inputs – Ports P1, P2, P3, and P4
        3. 8.8.5.3 Leakage Current – General-Purpose I/O
        4. 8.8.5.4 Outputs – General-Purpose I/O (Full Drive Strength)
        5. 8.8.5.5 Outputs – General-Purpose I/O (Reduced Drive Strength)
        6. 8.8.5.6 Output Frequency – Ports P1, P2 and P3
        7. 8.8.5.7 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
        8. 8.8.5.8 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
      6. 8.8.6  PMM
        1. 8.8.6.1 PMM, Core Voltage
        2. 8.8.6.2 PMM, SVS High Side
        3. 8.8.6.3 PMM, SVM High Side
        4. 8.8.6.4 PMM, SVS Low Side
        5. 8.8.6.5 PMM, SVM Low Side
      7. 8.8.7  Timers
        1. 8.8.7.1 Timer_A, Timers TA0, TA1, and TA2
        2. 8.8.7.2 Timer_B, Timer TB0
      8. 8.8.8  Battery Backup
        1. 8.8.8.1 Battery Backup
      9. 8.8.9  USCI
        1. 8.8.9.1 USCI (UART Mode)
        2. 8.8.9.2 USCI (SPI Master Mode)
        3. 8.8.9.3 USCI (SPI Slave Mode)
        4. 8.8.9.4 USCI (I2C Mode)
      10. 8.8.10 LCD Controller
        1. 8.8.10.1 LCD_B Operating Conditions
        2. 8.8.10.2 LCD_B, Electrical Characteristics
      11. 8.8.11 CTSD16
        1. 8.8.11.1 CTSD16, Power Supply and Operating Conditions
        2.       66
        3. 8.8.11.2 CTSD16, External Voltage Reference
        4. 8.8.11.3 CTSD16, Input Range
        5. 8.8.11.4 CTSD16, Performance
        6.       70
        7. 8.8.11.5 Built-in Vcc Sense
        8. 8.8.11.6 Temperature Sensor
      12. 8.8.12 REF
        1. 8.8.12.1 REF and REFBG, Built-In Reference
      13. 8.8.13 DAC
        1. 8.8.13.1 12-Bit DAC, Supply Specifications
        2. 8.8.13.2 12-Bit DAC, Linearity Specifications
        3. 8.8.13.3 12-Bit DAC, Output Specifications
        4. 8.8.13.4 12-Bit DAC, Reference Input Specifications
        5. 8.8.13.5 12-Bit DAC, Dynamic Specifications
        6. 8.8.13.6 12-Bit DAC, Dynamic Specifications (Continued)
      14. 8.8.14 Operational Amplifier
        1. 8.8.14.1 Operational Amplifier, OA0, OA1, PGA Buffers
        2. 8.8.14.2 OA, Current Calculation
      15. 8.8.15 Switches
        1. 8.8.15.1 Ground Switches (GSW0A, GSW0B, GSW1A, GSW1B)
        2. 8.8.15.2 Operational Amplifier Switches
      16. 8.8.16 Comparator
        1. 8.8.16.1 Comparator_B
      17. 8.8.17 USB
        1. 8.8.17.1 Ports PU.0 and PU.1
        2. 8.8.17.2 USB Output Ports DP and DM
        3. 8.8.17.3 USB Input Ports DP and DM
        4. 8.8.17.4 USB-PWR (USB Power System)
        5. 8.8.17.5 USB-PLL (USB Phase-Locked Loop)
      18. 8.8.18 LDO-PWR (LDO Power System)
        1. 8.8.18.1 LDO-PWR (LDO Power System)
      19. 8.8.19 Flash
        1. 8.8.19.1 Flash Memory
      20. 8.8.20 Debug and Emulation
        1. 8.8.20.1 JTAG and Spy-Bi-Wire Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  CPU
    3. 9.3  Instruction Set
    4. 9.4  Operating Modes
    5. 9.5  Interrupt Vector Addresses
    6. 9.6  USB BSL
    7. 9.7  UART BSL
    8. 9.8  JTAG Operation
      1. 9.8.1 JTAG Standard Interface
      2. 9.8.2 Spy-Bi-Wire Interface
    9. 9.9  Flash Memory
    10. 9.10 RAM
    11. 9.11 Backup RAM
    12. 9.12 Peripherals
      1. 9.12.1  Digital I/O
      2. 9.12.2  Port Mapping Controller
      3. 9.12.3  Oscillator and System Clock
      4. 9.12.4  Power Management Module (PMM)
      5. 9.12.5  Hardware Multiplier (MPY32)
      6. 9.12.6  Real-Time Clock (RTC_B)
      7. 9.12.7  Watchdog Timer (WDT_A)
      8. 9.12.8  System Module (SYS)
      9. 9.12.9  DMA Controller
      10. 9.12.10 Universal Serial Communication Interface (USCI)
      11. 9.12.11 Timer TA0
      12. 9.12.12 Timer TA1
      13. 9.12.13 Timer TA2
      14. 9.12.14 Timer TB0
      15. 9.12.15 Comparator_B
      16. 9.12.16 Signal Chain
        1. 9.12.16.1 CTSD16
        2. 9.12.16.2 DAC12_A
        3. 9.12.16.3 Operational Amplifiers (OA)
        4. 9.12.16.4 Ground Switches (GSW)
      17. 9.12.17 REF Voltage Reference
      18. 9.12.18 CRC16
      19. 9.12.19 LCD_B
      20. 9.12.20 USB Universal Serial Bus
      21. 9.12.21 LDO and PU Port
      22. 9.12.22 Embedded Emulation Module (EEM) (L Version)
    13. 9.13 Input/Output Diagrams
      1. 9.13.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 9.13.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 9.13.3  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      4. 9.13.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 9.13.5  Port P5 (P5.0) Input/Output With Schmitt Trigger
      6. 9.13.6  Port P5 (P5.1 and P5.6) Input/Output With Schmitt Trigger
      7. 9.13.7  Port P5 (P5.3 to P5.5, P5.7) Input/Output With Schmitt Trigger
      8. 9.13.8  Port P6 (P6.0 to P6.1) Input/Output With Schmitt Trigger
      9. 9.13.9  Port P6 (P6.2 and P6.3) Input/Output With Schmitt Trigger
      10. 9.13.10 Port P6 (P6.4) Input/Output With Schmitt Trigger
      11. 9.13.11 Port P6 (P6.5) Input/Output With Schmitt Trigger
      12. 9.13.12 Port P6 (P6.6) Input/Output With Schmitt Trigger
      13. 9.13.13 Port P6 (P6.7) Input/Output With Schmitt Trigger
      14. 9.13.14 Port P7 (P7.2 and P7.3) Input/Output With Schmitt Trigger
      15. 9.13.15 Port P7 (P7.4) Input/Output With Schmitt Trigger
      16. 9.13.16 Port P7 (P7.5) Input/Output With Schmitt Trigger
      17. 9.13.17 Port P7 (P7.6) Input/Output With Schmitt Trigger
      18. 9.13.18 Port P7 (P7.7) Input/Output With Schmitt Trigger
      19. 9.13.19 Port P8 (P8.0 to P8.7) Input/Output With Schmitt Trigger
      20. 9.13.20 Port P9 (P9.0 to P9.7) Input/Output With Schmitt Trigger
      21. 9.13.21 Port U (PU.0/DP, PU.1/DM, PUR) USB Ports for MSP430FG662x
      22. 9.13.22 Port J (J.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      23. 9.13.23 Port J (J.1 to J.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    14. 9.14 Device Descriptors
    15. 9.15 Memory
      1. 9.15.1 Peripheral File Map
    16. 9.16 Identification
      1. 9.16.1 Revision Identification
      2. 9.16.2 Device Identification
      3. 9.16.3 JTAG Identification
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 External Oscillator
      3. 10.1.3 JTAG
      4. 10.1.4 Reset
      5. 10.1.5 Unused Pins
      6. 10.1.6 General Layout Recommendations
      7. 10.1.7 Do's and Don'ts
    2. 10.2 Peripheral- and Interface-Specific Design Information
      1. 10.2.1 CTSD16 Peripheral
        1. 10.2.1.1 Example Measurement Schematic – Differential Input
        2. 10.2.1.2 Example Measurement Schematic – Single-Ended Input
        3. 10.2.1.3 Design Requirements
        4. 10.2.1.4 Detailed Design Procedure
          1. 10.2.1.4.1 OSR and Sampling Frequency
          2. 10.2.1.4.2 Differential Input Range Explanation
          3. 10.2.1.4.3 Single-Ended Input Mode
          4. 10.2.1.4.4 Offset Calibration
        5. 10.2.1.5 Layout Guidelines
      2. 10.2.2 Operational Amplifier With Ground Switches Peripheral
        1. 10.2.2.1 Reference Schematic
        2. 10.2.2.2 Design Requirements
        3. 10.2.2.3 Detailed Design Procedure
        4. 10.2.2.4 Layout Guidelines
      3. 10.2.3 RTC_B With Battery Backup System
        1. 10.2.3.1 Partial Schematic
        2. 10.2.3.2 Retaining an Accurate Real-Time Clock (RTC) Through Main Supply Interrupts
        3. 10.2.3.3 Charging Super-Capacitors With Built-In Resistive Charger
      4. 10.2.4 LCD_B Peripheral
        1. 10.2.4.1 Partial Schematic
        2. 10.2.4.2 Design Requirements
        3. 10.2.4.3 Detailed Design Procedure
        4. 10.2.4.4 Layout Guidelines
      5. 10.2.5 DAC12 Peripheral
        1. 10.2.5.1 Partial Schematic
        2. 10.2.5.2 Design Requirements
        3. 10.2.5.3 Detailed Design Procedure
        4. 10.2.5.4 Layout Guidelines
      6. 10.2.6 USB Module
      7. 10.2.7 LDO Module
        1. 10.2.7.1 Partial Schematic
  11. 11Device and Documentation Support
    1. 11.1  Getting Started
    2. 11.2  Device Nomenclature
    3. 11.3  Tools and Software
    4. 11.4  Documentation Support
    5. 11.5  Related Links
    6. 11.6  支持资源
    7. 11.7  Trademarks
    8. 11.8  静电放电警告
    9. 11.9  Export Control Notice
    10. 11.10 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

德州仪器 (TI) MSP430FG662x 和 MSP430FG642x 微控制器 (MCU) 属于 MSP430 计量和监控产品系列。该架构和集成外设与五种低功耗模式相结合并经过优化，可在便携式和电池供电测量应用中延长电池寿命。该器件具有一个强大的 16 位 RISC CPU、16 位寄存器和有助于实现出色编码效率的常数发生器。数控振荡器 (DCO) 可以让器件在不到 5µs 的时间内从低功耗模式唤醒至激活模式。

MSP430FG662x MCU 面向小型信号监控应用、包括一个 16 位 Σ-Δ ADC、双低功耗运算放大器、双 12 位 DAC、电压比较器、四个 USCI（两个 USCI_A 模块和两个 USCI_B 模块）、四个 16 位计时器、一个硬件乘法器、一个 DMA 模块、一个 RTC 模块、一个 LCD 驱动器（此驱动器在 100 引脚器件和 113 引脚器件中具有高达 160 段的集成对比度控制、集成式全速 USB、辅助电源系统、高达 128KB 闪存、10KB SRAM 和 73 个 I/O 引脚）。

MSP430FG642x MCU 面向小型信号监控应用、包括一个 16 位 Σ-Δ ADC、双低功耗运算放大器、双 12 位 DAC、电压比较器、四个 USCI（两个 USCI_A 模块和两个 USCI_B 模块）、四个 16 位计时器、一个硬件乘法器、一个 DMA 模块、一个 RTC 模块、一个 LCD 驱动器（此驱动器在 100 引脚器件和 113 引脚器件中具有高达 160 段的集成对比度控制、辅助电源系统、高达 128KB 闪存、10KB SRAM 和 73 个 I/O 引脚）。

这些微控制器的典型应用包括小信号监控应用，例如手持式测试和测量设备、现场变送器和血糖仪。这些微控制器可通过高模拟集成降低总体系统成本，并通过低功耗运行实现较长的电池寿命。

MSP430FG662x 和 MSP430FG642x MCU 由一款广泛的硬件和软件生态系统提供支持，随附参考设计和代码示例，以便用户快速开展设计。开发套件包括 MSP-TS430PZ100AUSB 100 引脚目标开发板。TI 还提供免费的 MSP430Ware™ 软件，该软件以 Code Composer Studio™ IDE 桌面和云版本组件的形式提供（位于 TI Resource Explorer 中）。TI E2E™ 支持论坛还为 MSP430 MCU 提供广泛的在线配套资料、培训和在线支持。

有关完整的模块说明，请参阅《MSP430F5xx 和 MSP430F6xx 系列用户指南》。

器件信息
器件型号(1) 封装 封装尺寸(2)
MSP430FG6626IPZ PZ (100) 14mm x 14mm
MSP430FG6626IZCA nFBGA (113) 7mm × 7mm
MSP430FG6626IZQW(3) MicroStar Junior™ BGA (113) 7mm × 7mm
(1) 如需获得所有可用器件的全新器件、封装和订购信息，请参阅封装选项附录（Section 12）或浏览 TI 网站 www.ti.com。
(2) 这里显示的尺寸为近似值。若要获得包含误差值的封装尺寸，请参阅Section 12中的机械数据。
(3) 采用 ZQW (MicroStar Junior BGA) 封装的所有可订购器件型号均已更改为最后可采购期限的状态。有关此状态的详细信息，请访问产品生命周期页面。