ZHCSS00AA march   2000  – july 2023 LP2985-N

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Noise Bypass Capacitor (CBYPASS)
      4. 8.1.4 Reverse Current
      5. 8.1.5 Power Dissipation (PD)
      6. 8.1.6 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Characteristics
        2. 8.2.2.2 ON/OFF Input Operation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Device Nomenclature
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Application Curves

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0 V or 2.5 V (whichever is greater), IOUT = 1 mA, ON/OFF pin tied to VIN, CIN = 1.0 µF, and COUT = 4.7 µF (unless otherwise noted)

GUID-00504EAE-BEFB-4D10-986D-C19D00014415-low.png
 
Figure 8-3 Short-Circuit Current for Legacy Chip at VIN = 6 V
GUID-FE4DCDE3-99AB-4159-8CB4-FF2249B1B8B0-low.png
 
Figure 8-5 Short-Circuit Current for Legacy Chip at VIN = 16 V
GUID-3F9EA045-6A14-46C6-B5BC-AD8F6A7ED09B-low.png
 
Figure 8-7 Load Transient Response for Legacy Chip
GUID-DA4D6F90-DC42-4A38-9A16-DC67BB10F1CE-low.png
 
Figure 8-9 Load Transient Response for Legacy Chip
GUID-1C5467DD-7C5B-4107-B33D-73AF06A7825E-low.png
 
Figure 8-11 Load Transient Response for Legacy Chip
GUID-DD8656C1-58FE-41E3-8407-674D2E18D859-low.png
 
 
Figure 8-13 Line Transient Response for Legacy Chip
GUID-C1A79F50-1B77-41F1-ADBE-54E11A825DD5-low.png
 
 
Figure 8-15 Line Transient Response for Legacy Chip
GUID-86E6D636-1D6F-4F2D-8770-1DE149B63F7E-low.png
 
 
Figure 8-17 Line Transient Response for Legacy Chip
GUID-61C30D74-0E8C-4FF4-B2AD-800450C9FFDF-low.png
 
 
Figure 8-19 Line Transient Response for Legacy Chip
GUID-7E5B83DF-21AA-46A8-B159-74767B89411D-low.png
 
Figure 8-21 Turn-On Time for Legacy Chip
GUID-AC79235E-6DED-4F0F-888C-D79EA0B7886E-low.png
 
Figure 8-23 Turn-On Time for Legacy Chip
GUID-9637A282-5609-456D-8CAA-248C2744F4DF-low.png
 
Figure 8-25 Turn-On Time for Legacy Chip
GUID-5CD88FAB-0F38-45D9-9D42-3C67F9752FAB-low.png
 
Figure 8-27 Turn-On Time for Legacy Chip
GUID-20221126-SS0I-9GNW-BTGQ-RXPQL55DMNVN-low.svg
VIN = 6 V
Figure 8-4 Short-Circuit Current for New Chip at VIN = 6 V
GUID-20221126-SS0I-G3GN-FJ9B-SX3GLPWKFP4B-low.svg
 
Figure 8-6 Short-Circuit Current for New Chip at VIN = 16 V
GUID-20221126-SS0I-LWJ4-CC98-B1T3GBMKLXSQ-low.svg
dI/dt = 1 A/μF
Figure 8-8 Load Transient Response for New Chip
GUID-20221126-SS0I-PPZV-NW7C-SGGWWSGDJTP2-low.svg
dI/dt = 1 A/μF
Figure 8-10 Load Transient for New Chip
GUID-20221126-SS0I-PGX3-VDK2-JDS81DGVQSHL-low.svg
dI/dt = 1 A/μF
Figure 8-12 Load Transient Response for New Chip
GUID-20221126-SS0I-VKGW-HPKF-2JMGSFFL2BMF-low.svg
VOUT = 3.3 V, CBYP = 0 nF, ΔVIN = 1 V, IOUT = 1 mA,
dV/dt = 1 V/μF
Figure 8-14 Line Transient Response for New Chip
GUID-20221126-SS0I-X6LZ-F68H-KDXJXLHGHFR9-low.svg
VOUT = 3.3 V, CBYP = 0 nF, ΔVIN = 1 V, IOUT = 150 mA,
dV/dt = 1 V/μF
Figure 8-16 Line Transient Response for New Chip
GUID-20221126-SS0I-4J52-XFK7-FN2J26RS6MBG-low.svg
VOUT = 3.3 V, CBYP = 10 nF, ΔVIN = 1 V, IOUT = 1 mA,
dV/dt = 1 V/μF
Figure 8-18 Line Transient Response for New Chip
GUID-20221126-SS0I-CKRZ-Q7BN-NWRN7D5HQ3KB-low.svg
VOUT = 3.3 V, CBYP = 10 nF, ΔVIN = 1 V, IOUT = 150 mA,
dV/dt = 1 V/μF
Figure 8-20 Line Transient Response for New Chip
GUID-20221126-SS0I-QCBR-6DPC-K3DH8XJG29N0-low.svg
 
Figure 8-22 Turn-On Time for New Chip
GUID-20221126-SS0I-S4MK-XDB8-LQX17VRSCGW4-low.svg
 
Figure 8-24 Turn-On Time for New Chip
GUID-20221126-SS0I-N1T1-LF0F-DVWZZVZRCL0D-low.svg
COUT = 4.7 μF
Figure 8-26 Turn-On Time for New Chip
GUID-20221126-SS0I-BH1V-8JFF-W8G5ZZCPMNLD-low.svg
COUT = 4.7 μF
Figure 8-28 Turn-On Time for New Chip