ZHCSU12M March   2000  – June 2025 LP2982

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors (Legacy Chip)
        2. 7.1.1.2 Recommended Capacitors (New Chip)
      2. 7.1.2 Input Capacitor Requirements
      3. 7.1.3 Output Capacitor Requirements
      4. 7.1.4 Noise Bypass Capacitor (CBYPASS)
      5. 7.1.5 Reverse Current
      6. 7.1.6 Power Dissipation (PD)
      7. 7.1.7 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/ OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 器件和文档支持
    1. 8.1 器件命名规则
    2. 8.2 第三方产品免责声明
    3. 8.3 文档支持
      1. 8.3.1 相关文档
    4. 8.4 接收文档更新通知
    5. 8.5 支持资源
    6. 8.6 商标
    7. 8.7 静电放电警告
    8. 8.8 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision L (December 2023) to Revision M (June 2025)

  • 更改了整个文档,以识别旧芯片和新芯片的功能和差异Go
  • 更改了说明部分中与新芯片相关的软启动讨论Go
  • Changed Overview sectionGo
  • Changed Functional Block Diagrams sectionGo
  • Changed Current Limit sectionGo
  • Changed Recommended Capacitors (Legacy Chip) sectionGo
  • Changed Recommended Capacitors (New Chip) sectionGo
  • Changed Input Capacitor Requirements sectionGo
  • Changed Input and Output Capacitor Requirements sectionGo
  • 更改了器件命名规则部分Go

Changes from Revision K (June 2016) to Revision L (December 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 更改了整个文档以与当前系列格式保持一致Go
  • 向文档添加了 M3 器件Go