ZHCSU12M March   2000  – June 2025 LP2982

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors (Legacy Chip)
        2. 7.1.1.2 Recommended Capacitors (New Chip)
      2. 7.1.2 Input Capacitor Requirements
      3. 7.1.3 Output Capacitor Requirements
      4. 7.1.4 Noise Bypass Capacitor (CBYPASS)
      5. 7.1.5 Reverse Current
      6. 7.1.6 Power Dissipation (PD)
      7. 7.1.7 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/ OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 器件和文档支持
    1. 8.1 器件命名规则
    2. 8.2 第三方产品免责声明
    3. 8.3 文档支持
      1. 8.3.1 相关文档
    4. 8.4 接收文档更新通知
    5. 8.5 支持资源
    6. 8.6 商标
    7. 8.7 静电放电警告
    8. 8.8 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1 V, COUT = 4.7 μF, CIN = 1 μF, all voltage options, ON/ OFF pin tied to VIN.

LP2982 Output Voltage
            vs Temperature (Legacy Chip)
 
Figure 5-1 Output Voltage vs Temperature (Legacy Chip)
LP2982 Output Voltage
            vs Temperature (Legacy Chip)
 
Figure 5-3 Output Voltage vs Temperature (Legacy Chip)
LP2982 Output Voltage
            vs VIN (Legacy Chip)
 VOUT = 5.0 V
Figure 5-5 Output Voltage vs VIN (Legacy Chip)
LP2982 Output Voltage
            vs VIN (Legacy Chip)
 VOUT = 3.0 V
Figure 5-7 Output Voltage vs VIN (Legacy Chip)
LP2982 Dropout Voltage
            vs Temperature (Legacy Chip)
 
Figure 5-9 Dropout Voltage vs Temperature (Legacy Chip)
LP2982 Dropout Voltage
            vs Load Current (Legacy Chip)
 
Figure 5-11 Dropout Voltage vs Load Current (Legacy Chip)
LP2982 Ground Pin
            Current vs Temperature (Legacy Chip)
 
Figure 5-13 Ground Pin Current vs Temperature (Legacy Chip)
LP2982 Ground Pin
            Current vs Load Current (Legacy Chip)
 
Figure 5-15 Ground Pin Current vs Load Current (Legacy Chip)
LP2982 Input Current
            vs VIN (Legacy Chip)
 VOUT = 5 V
Figure 5-17 Input Current vs VIN (Legacy Chip)
LP2982 Input Current vs Input Voltage (New
            Chip)
 VOUT = 3.3 V
Figure 5-19 Input Current vs Input Voltage (New Chip)
LP2982 Line Transient
            Response (Legacy Chip)
 
Figure 5-21 Line Transient Response (Legacy Chip)
LP2982 Load Transient
            Response (Legacy Chip)
 
Figure 5-23 Load Transient Response (Legacy Chip)
LP2982 Load Transient
            Response (Legacy Chip)
 
Figure 5-25 Load Transient Response (Legacy Chip)
LP2982 Load Transient Response (New
            Chip)
dI/dt = 1 A/μs
Figure 5-27 Load Transient Response (New Chip)
LP2982 Short-Circuit
            Current vs Time (Legacy Chip)
VIN = 16 V
Figure 5-29 Short-Circuit Current vs Time (Legacy Chip)
LP2982 Short-Circuit Current vs Time (New
            Chip)
 
Figure 5-31 Short-Circuit Current vs Time (New Chip)
LP2982 Short-Circuit Current vs Temperature
            (New Chip)
 
Figure 5-33 Short-Circuit Current vs Temperature (New Chip)
LP2982 Output
            Impedance vs Frequency (Legacy Chip)
 
Figure 5-35 Output Impedance vs Frequency (Legacy Chip)
LP2982 ON/OFF Pin Current vs VON/OFF (Legacy Chip)
 
Figure 5-37 ON/OFF Pin Current vs VON/OFF (Legacy Chip)
LP2982 ON/OFF Pin Current vs VON/OFF
            (New Chip)
VIN = 4.3 V
Figure 5-39 ON/OFF Pin Current vs VON/OFF (New Chip)
LP2982 ON/OFF Threshold vs Temperature (New Chip)
 
Figure 5-41 ON/OFF Threshold vs Temperature (New Chip)
LP2982 Output Reverse
            Leakage vs Temperature (Legacy Chip)
 
Figure 5-43 Output Reverse Leakage vs Temperature (Legacy Chip)
LP2982 Output Noise
            Density (Legacy Chip)
 
Figure 5-45 Output Noise Density (Legacy Chip)
LP2982 Output Noise
            Density (Legacy Chip)
 
Figure 5-47 Output Noise Density (Legacy Chip)
LP2982 Output Noise Density vs Frequency
            (New Chip)
VIN = 4.3V, VOUT = 3.3V, COUT = 2.2μF and ILOAD = 1 mA
Figure 5-49 Output Noise Density vs Frequency (New Chip)
LP2982 Ripple Rejection vs IOUT
            (New Chip)
VOUT = 3.3 V, Cbyp = 0 nF
Figure 5-51 Ripple Rejection vs IOUT (New Chip)
LP2982 Turnon Waveform
            (Legacy Chip)
 
Figure 5-53 Turnon Waveform (Legacy Chip)
LP2982 Turnon Waveform
            (Legacy Chip)
 
Figure 5-55 Turnon Waveform (Legacy Chip)
LP2982 Turnon Waveform (New Chip)
Cbyp = 0.1 nF
Figure 5-57 Turnon Waveform (New Chip)
LP2982 Output Voltage
            vs Temperature (Legacy Chip)
 
Figure 5-2 Output Voltage vs Temperature (Legacy Chip)
LP2982 Output Voltage
            vs Temperature (New Chip)
VIN = 4.3 V, VOUT = 3.3 V
Figure 5-4 Output Voltage vs Temperature (New Chip)
LP2982 Output Voltage
            vs VIN (Legacy Chip)
 VOUT = 3.3 V
Figure 5-6 Output Voltage vs VIN (Legacy Chip)
LP2982 Output Voltage vs VIN (New
            Chip)
VOUT = 3.3 V 
Figure 5-8 Output Voltage vs VIN (New Chip)
LP2982 Dropout Voltage vs Temperature (New
            Chip)
 
Figure 5-10 Dropout Voltage vs Temperature (New Chip)
LP2982 Dropout Voltage vs Load Current (New
            Chip)
 
Figure 5-12 Dropout Voltage vs Load Current (New Chip)
LP2982 Ground Pin
            Current vs Temperature (New Chip)
 
Figure 5-14 Ground Pin Current vs Temperature (New Chip)
LP2982 Ground Pin Current vs Load Current
            (New Chip)
 
Figure 5-16 Ground Pin Current vs Load Current (New Chip)
LP2982 Input Current
            vs VIN (Legacy Chip)
 VOUT = 5 V
Figure 5-18 Input Current vs VIN (Legacy Chip)
LP2982 Line Transient
            Response (Legacy Chip)
 
Figure 5-20 Line Transient Response (Legacy Chip)
LP2982 Line Transient Response (New
            Chip)
VOUT = 3.3 V, ΔVIN = 1 V, IOUT = 50 mA, dV/dt = 1 V/μs
Figure 5-22 Line Transient Response (New Chip)
LP2982 Load Transient
            Response (Legacy Chip)
 
Figure 5-24 Load Transient Response (Legacy Chip)
LP2982 Load Transient
            Response (Legacy Chip)
 
Figure 5-26 Load Transient Response (Legacy Chip)
LP2982 Short-Circuit
            Current vs Time (Legacy Chip)
VIN = 6 V
Figure 5-28 Short-Circuit Current vs Time (Legacy Chip)
LP2982 Short-Circuit Current vs Time (New
            Chip)
VIN = 6 V
Figure 5-30 Short-Circuit Current vs Time (New Chip)
LP2982 Instantaneous
            Short-Circuit Current vs Temperature (Legacy Chip)
 
Figure 5-32 Instantaneous Short-Circuit Current vs Temperature (Legacy Chip)
LP2982 Instantaneous
            Short Circuit Current vs Output Voltage (Legacy Chip)
 
Figure 5-34 Instantaneous Short Circuit Current vs Output Voltage (Legacy Chip)
LP2982 Output
            Impedance vs Frequency (Legacy Chip)
 
Figure 5-36 Output Impedance vs Frequency (Legacy Chip)
LP2982 ON/OFF Pin Current vs VON/OFF
            (New Chip)
VIN = 16 V
Figure 5-38 ON/OFF Pin Current vs VON/OFF (New Chip)
LP2982 ON/OFF Threshold vs Temperature (Legacy Chip)
 
Figure 5-40 ON/OFF Threshold vs Temperature (Legacy Chip)
LP2982 Input-to-Output
            Leakage vs Temperature (Legacy Chip)
 
Figure 5-42 Input-to-Output Leakage vs Temperature (Legacy Chip)
LP2982 Output Reverse
            Leakage vs Temperature (New Chip)
 
Figure 5-44 Output Reverse Leakage vs Temperature (New Chip)
LP2982 Output Noise
            Density (Legacy Chip)
 
Figure 5-46 Output Noise Density (Legacy Chip)
LP2982 Output Noise Density vs Frequency
            (New Chip)
VIN = 4.3V, VOUT = 3.3V, COUT = 2.2μF and ILOAD = 50 mA
Figure 5-48 Output Noise Density vs Frequency (New Chip)
LP2982 Ripple
            Rejection (Legacy Chip)
 
Figure 5-50 Ripple Rejection (Legacy Chip)
LP2982 Ripple Rejection vs IOUT
            (New Chip)
VOUT = 3.3 V, Cbyp = 10 nF
Figure 5-52 Ripple Rejection vs IOUT (New Chip)
LP2982 Turnon Waveform
            (Legacy Chip)
 
Figure 5-54 Turnon Waveform (Legacy Chip)
LP2982 Turnon Waveform (New Chip)
Cbyp = 0 nF
Figure 5-56 Turnon Waveform (New Chip)
LP2982 Turnon Waveform (New Chip)
Cbyp = 1 nF
Figure 5-58 Turnon Waveform (New Chip)