ZHCS566I February   2010  – March 2022 LMZ12010

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Overvoltage Protection
      2. 7.3.2 Current Limit
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Prebiased Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Enable Divider, RENT, RENB, and RENH Selection
        2. 8.2.2.2 Output Voltage Selection
        3. 8.2.2.3 Soft-Start Capacitor Selection
        4. 8.2.2.4 Tracking Supply Divider Option
        5. 8.2.2.5 COUT Selection
        6. 8.2.2.6 CIN Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
    4. 10.4 Power Module SMT Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 支持资源
    4. 11.4 接收文档更新通知
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

COUT Selection

None of the required COUT output capacitance is contained within the module. A minimum value ranging from 330 μF for 6 VOUT to 660 μF for 1.2-VOUT applications is required based on the values of internal compensation in the error amplifier. These minimum values can be decreased if the effective capacitor ESR is higher than 15 mΩ.

A low-ESR (15 mΩ) tantalum, organic semiconductor or specialty polymer capacitor types in parallel with a 47-nF X7R ceramic capacitor for high-frequency noise reduction is recommended for obtaining lowest ripple. The output capacitor COUT can consist of several capacitors in parallel placed in close proximity to the module. The output voltage ripple of the module depends on the equivalent series resistance (ESR) of the capacitor bank, and can be calculated by multiplying the ripple current of the module by the effective impedance of your chosen output capacitors. Electrolytic capacitors will have large ESR and lead to larger output ripple than ceramic or polymer types. For this reason, a combination of ceramic and polymer capacitors is recommended for low output ripple performance.

The output capacitor assembly must also meet the worst case ripple current rating of ΔiL. Loop response verification is also valuable to confirm closed loop behavior.

For applications with dynamic load steps; Equation 10 provides a good first pass approximation of COUT for load transient requirements.

Equation 10. GUID-E61CA100-9FD4-4069-A126-B68171C7A177-low.gif

For 12 VIN, 3.3 VOUT, a transient voltage of 5% of VOUT = 0.165 V (ΔVOUT), a 9-A load step (ISTEP), an output capacitor effective ESR of 3 mΩ, and a switching frequency of 350 kHz (fSW):

Equation 11. GUID-BCC6EE3B-1A65-4FD5-BC22-0864EEB2043E-low.gif
Note:

The stability requirement for minimum output capacitance must always be met.

One recommended output capacitor combination is two 330-μF, 15-mΩ ESR tantalum polymer capacitors connected in parallel with a 47-µF 6.3-V X5R ceramic. This combination provides excellent performance that can exceed the requirements of certain applications. Additionally some small 47-nF ceramic capacitors can be used for high-frequency EMI suppression.