ZHCSHQ3F August   2017  – November 2020 LMR33630

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Dropout
      3. 8.4.3 Minimum Switch On-Time
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Choosing the Switching Frequency
        3. 9.2.2.3  Setting the Output Voltage
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Input Capacitor Selection
        7. 9.2.2.7  CBOOT
        8. 9.2.2.8  VCC
        9. 9.2.2.9  CFF Selection
        10. 9.2.2.10 External UVLO
        11. 9.2.2.11 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RNX|12
  • DDA|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision E (May 2020) to Revision F (November 2020)

  • 向特性 添加了功能安全项目Go
  • 更新了整个文档的表、图和交叉参考的编号格式。Go
  • Added RNX pinout drawingGo
  • Added VQFN package drawingGo

Changes from Revision D (March 2019) to Revision E (May 2020)

  • 添加了指向 TPSM53603 产品页面的链接Go

Changes from Revision C (June 2018) to Revision D (March 2019)

  • Changed heading to device option Go
  • Changed Minimum peak current to reflect ATE data.Go
  • Changed zero cross to reflect ATE data.Go
  • Changed to new current limit equationGo
  • Added new de-rate curveGo

Changes from Revision B (April 2018) to Revision C (June 2018)

  • Changed heading to device option Go
  • Added graphs for Typical Switching Frequency in Dropout Mode Go

Changes from Revision A (February 2018) to Revision B (April 2018)

  • 在整个数据表中添加了 WSON 信息Go
  • Changed block diagram to fix drawing errorGo
  • Added RNX package drawings Go

Changes from Revision * (August 2017) to Revision A (February 2018)

  • 首次发布量产数据数据表Go