ZHCSN30C December   2020  – March 2022 LMP7704-SP

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 5 V
    6. 6.6 Electrical Characteristics: VS = 10 V
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Radiation Hardened Performance
      2. 7.3.2 Engineering Model (Devices With /EM Suffix)
      3. 7.3.3 Capacitive Load
      4. 7.3.4 Input Capacitance
      5. 7.3.5 Diodes Between the Inputs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Precision Current Source
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Low Input Voltage Noise
      2. 8.1.2 Total Noise Contribution
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

Take care to minimize the loop area formed by the bypass capacitor connection between supply pins and ground. Use a ground plane underneath the device; best practice is for any bypass components to ground to have a nearby via to the ground plane. The optimum bypass capacitor placement is closest to the corresponding supply pin. Use of thicker traces from the bypass capacitors to the corresponding supply pins lowers the power-supply inductance and provides a more stable power supply.

To minimize stray parasitics, place the feedback components as close as possible to the device.