ZHCSN30D December   2020  – October 2024 LMP7704-SP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 5 V
    6. 5.6 Electrical Characteristics VS = 10 V
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Radiation Hardened Performance
      2. 6.3.2 Engineering Model (Devices With /EM Suffix)
      3. 6.3.3 Diodes Between the Inputs
      4. 6.3.4 Capacitive Load
      5. 6.3.5 Input Capacitance
    4. 6.4 Device Functional Modes
      1. 6.4.1 Precision Current Source
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Low Input Voltage Noise
      2. 7.1.2 Total Noise Contribution
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

8.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.