ZHCSN30C
December 2020 – March 2022
LMP7704-SP
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics: VS = 5 V
6.6
Electrical Characteristics: VS = 10 V
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Radiation Hardened Performance
7.3.2
Engineering Model (Devices With /EM Suffix)
7.3.3
Capacitive Load
7.3.4
Input Capacitance
7.3.5
Diodes Between the Inputs
7.4
Device Functional Modes
7.4.1
Precision Current Source
8
Application and Implementation
8.1
Application Information
8.1.1
Low Input Voltage Noise
8.1.2
Total Noise Contribution
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
接收文档更新通知
11.2
支持资源
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
HBH|14
MCCF004C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsn30c_oa
zhcsn30c_pm
11.5
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。