ZHCSN30C 数据表 | 德州仪器 TI.com.cn

ZHCSN30C December 2020 – March 2022 LMP7704-SP

PRODUCTION DATA

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机械数据 (封装 | 引脚)

HBH|14
- MCCF004B

散热焊盘机械数据 (封装 | 引脚)

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6.7 Typical Characteristics

at T_A = 25°C, V_CM = V_S/2, and R_L > 10 kΩ (unless otherwise noted)

Figure 6-1 Offset Voltage Distribution

Figure 6-3 Offset Voltage Distribution

Figure 6-5 Offset Voltage Distribution

Figure 6-7 Offset Voltage vs Temperature

Figure 6-9 Offset Voltage vs Supply Voltage

Figure 6-11 Offset Voltage vs V_CM

Figure 6-13 Input Bias Current vs V_CM

Figure 6-15 Input Bias Current vs V_CM

Figure 6-17 Input Bias Current vs V_CM

Figure 6-19 PSRR vs Frequency

Figure 6-21 Sinking Current vs Supply Voltage

Figure 6-23 Output Voltage vs Output Current

Figure 6-25 Open-Loop Frequency Response

Figure 6-27 Large Signal Step Response

Figure 6-29 Large Signal Step Response

Figure 6-31 Input Voltage Noise vs Frequency

Figure 6-33 Output Swing High vs Supply Voltage

Figure 6-35 Output Swing High vs Supply Voltage

Figure 6-37 THD+N vs Frequency

Figure 6-39 Crosstalk Rejection Ratio vs Frequency (LMP7702/LMP7704)

Figure 6-2 TCV_OS Distribution

Figure 6-4 TCV_OS Distribution

Figure 6-6 TCV_OS Distribution

Figure 6-8 CMRR vs Frequency

Figure 6-10 Offset Voltage vs V_CM

Figure 6-12 Offset Voltage vs V_CM

Figure 6-14 Input Bias Current vs V_CM

Figure 6-16 Input Bias Current vs V_CM

Figure 6-18 Input Bias Current vs V_CM

Figure 6-20 Supply Current vs Supply Voltage (Per Channel)

Figure 6-22 Sourcing Current vs Supply Voltage

Figure 6-24 Slew Rate vs Supply Voltage

Figure 6-26 Open-Loop Frequency Response

Figure 6-28 Small Signal Step Response

Figure 6-30 Small Signal Step Response

Figure 6-32 Open Loop Gain vs Output Voltage Swing

Figure 6-34 Output Swing Low vs Supply Voltage

Figure 6-36 Output Swing Low vs Supply Voltage

Figure 6-38 THD+N vs Output Voltage