SNAS889 March   2026 LMK6B

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Features Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
      4. 8.3.4 Output Terminations
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Clocking TI Clock Buffers with the LMK6Bx
      4. 9.2.4 Application Curves
        1. 9.2.4.1 LVDS Phase Noise Curves
        2. 9.2.4.2 AC-LVPECL Phase Noise Curves
        3. 9.2.4.3 LP-HCSL Phase Noise Curves
    3. 9.3 Replacing Competitor Oscillators with the LMK6Bx
      1. 9.3.1 Replacing a LVPECL oscillator with the LMK6Bx
      2. 9.3.2 Replacing a HCSL OSC With the LMK6Bx
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Providing Thermal Reliability
        2. 9.5.1.2 Recommended Solder Reflow Profile
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data
    2. 12.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

9.5.2 Layout Example

Figure 9-14 through Figure 9-18 show the printed circuit board (PCB) layout examples as done on the evaluation module (EVM) for the LMK6BEVM.

LMK6B PCB Layout Example From LMK6BEVMFigure 9-14 PCB Layout Example From LMK6BEVM
LMK6B PCB Layout Example From LMK6BEVM - Ground LayerFigure 9-16 PCB Layout Example From LMK6BEVM - Ground Layer
LMK6B PCB Layout Example From LMK6BEVM - Bottom LayerFigure 9-18 PCB Layout Example From LMK6BEVM - Bottom Layer
LMK6B PCB Layout Example From LMK6BEVM - Top LayerFigure 9-15 PCB Layout Example From LMK6BEVM - Top Layer
LMK6B PCB Layout Example From LMK6BEVM - Power LayerFigure 9-17 PCB Layout Example From LMK6BEVM - Power Layer