ZHCS807G February   2012  – August 2018 LMK00304

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      功能框图
      2.      LVPECL 输出摆幅 (VOD) 与频率间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VCC and VCCO Power Supplies
      2. 8.3.2 Clock Inputs
      3. 8.3.3 Clock Outputs
        1. 8.3.3.1 Reference Output
  9. Application and Implementation
    1. 9.1 Driving the Clock Inputs
    2. 9.2 Crystal Interface
    3. 9.3 Termination and Use of Clock Drivers
      1. 9.3.1 Termination for DC-Coupled Differential Operation
      2. 9.3.2 Termination for AC-Coupled Differential Operation
      3. 9.3.3 Termination for Single-Ended Operation
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing
    2. 10.2 Current Consumption and Power Dissipation Calculations
      1. 10.2.1 Power Dissipation Example: Worst-Case Dissipation
    3. 10.3 Power Supply Bypassing
      1. 10.3.1 Power Supply Ripple Rejection
    4. 10.4 Thermal Management
      1. 10.4.1 Support for PCB Temperature up to 105°C
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from F Revision (March 2016) to G Revision

  • Added new rows to the Thermal Information tableGo
  • Added the Support for PCB Temperature up to 105°C section Go

Changes from E Revision (May 2013) to F Revision

  • 已添加 “超低附加抖动”至文档标题Go
  • 已添加、更新或重命名以下部分:规范详细 说明应用和实施电源相关建议器件和文档支持机械、封装和可订购信息Go
  • Changed Cin (typ) from 1 pF to 4 pF (based on updated test method) in Electrical Characteristics: Crystal InterfaceGo
  • Added "Additive RMS Jitter, Integration Bandwidth 10 kHz to 20 MHz” parameter with 100 MHz and 156.25 MHz Test conditions, Typical values, Max values, and footnotes in Electrical Characteristics: LVPECL Outputs Go
  • Added "Additive RMS Jitter, Integration Bandwidth 10 kHz to 20 MHz” parameter with 100 MHz and 156.25 MHz Test conditions, Typical values, Max values, and footnotes in Electrical Characteristics: LVDS Outputs Go
  • Added footnote for VI_SE parameter in the Electrical Characteristics table. Go
  • Added new paragraph at end of Driving the Clock InputsGo
  • Changed "LMK00301" to "LMK00304" in Figure 27 and Figure 28Go
  • Changed Cin = 4 pF (typ, based on updated test method) in Crystal InterfaceGo
  • Added POWER SUPPLY SEQUENCING Go

Changes from D Revision (February 2013) to E Revision

  • Changed VCM text to condition for VIH to VCM parameter group.Go
  • Deleted VIH min value from Electrical Characteristics table.Go
  • Deleted VIL max value from Electrical Characteristics table.Go
  • Added VI_SE parameter and spec limits with corresponding table note to Electrical Characteristics Table.Go
  • Changed third paragraph in Driving the Clock Inputs section to include CLKin* and LVCMOS text. Revised to better correspond with information in Electrical Characteristics Table.Go
  • Changed bypass cap text to signal attenuation text of the fourth paragraph in Driving the Clock Inputs section.Go
  • Changed Single-Ended LVCMOS Input, DC Coupling with Common Mode Biasing image with revised graphic.Go
  • Added text to second paragraph of Termination for AC Coupled Differential Operation to explain graphic update to Differential LVDS Operation with AC Coupling to Receivers.Go
  • Changed graphic for Differential LVDS Operation, AC Coupling, No Biasing by the Receiver and updated caption.Go