ZHCSGX1G May   2004  – February 2025 LM60

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM60 Transfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Centigrade Thermostat Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Conserving Power Dissipation With Shutdown
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision F (August 2017) to Revision G (February 2025)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated the Device Comparison section with existing OPNs and adding Device Nomenclature tableGo
  • Changed Machine model (MM) Electrostatic discharge to Charged-device model (CDM).Go
  • Changed minimum specified temperature for LM60B from -25°C to -40°C in the New chip.Go
  • Changed DBZ and LP packages Thermal Information section. in the New chipGo
  • Added “operating current” and “Change of quiescent current” for the New chip.Go
  • Added graphs for new chip, reordered and corrected the graphs for legacy chipGo
  • Added corrections to the Thermal Resistance Junction to Air (Legacy chip) graphGo
  • Added Thermal Response in Stirred Oil Bath With Heat Sink (0.5 inches × 0.5 inches PCB board) graph for both Legacy and New chipsGo
  • Added Thermal Response in Still Air Without a Heat Sink (Both Legacy and New chip together in a new test setup) graph for both Legacy and New chipsGo
  • Added the Start-Up Voltage vs Temperature, Quiescent Current vs Temperature, Accuracy vs Temperature, Noise Voltage, Supply Current vs Supply Voltage and Start-Up Response graphs for New chipGo

Changes from Revision E (September 2015) to Revision F (August 2017)

  • 将汽车器件移到了单独的数据表 (SNIS197) 中Go
  • Added table note for the LM60BGo

Changes from Revision D (November 2012) to Revision E (November 2014)

  • 添加了引脚配置和功能部分、ESD 等级表、特性说明部分、器件功能模式、应用和实施部分、电源相关建议部分、布局部分、器件和文档支持部分以及机械、封装和可订购信息部分Go