ZHCSGX1G May   2004  – February 2025 LM60

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM60 Transfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Centigrade Thermostat Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Conserving Power Dissipation With Shutdown
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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6.4 Thermal Information

THERMAL METRIC(1) LM60 UNIT
DBZ (SOT-23)
3 PINS		 LP (TO-92)
3 PINS
Legacy chip New chip Legacy chip New chip
RθJA(2) Junction-to-ambient thermal resistance 266 240.6 162 135.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 135 144.5 85 109.1 °C/W
RθJB Junction-to-board thermal resistance 59 72.3 - 108.9 °C/W
ψJT Junction-to-top characterization parameter 18 28.7 29 24.6 °C/W
ψJB Junction-to-board characterization parameter 58 71.7 142 108.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The junction to ambient thermal resistance (RθJA) is specified without a heat sink in still air.