ZHCSLO7B December   2020  – January 2023 LM25149-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
    1. 6.1 Wettable Flanks
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings 
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Active EMI Filter
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN)
      2. 8.3.2  High-Voltage Bias Supply Regulator (VCC, VCCX, VDDA)
      3. 8.3.3  Precision Enable (EN)
      4. 8.3.4  Power-Good Monitor (PG)
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Active EMI Filter
      7. 8.3.7  Dual Random Spread Spectrum (DRSS)
      8. 8.3.8  Soft Start
      9. 8.3.9  Output Voltage Setpoint (FB)
      10. 8.3.10 Minimum Controllable On Time
      11. 8.3.11 Error Amplifier and PWM Comparator (FB, EXTCOMP)
      12. 8.3.12 Slope Compensation
      13. 8.3.13 Inductor Current Sense (ISNS+, VOUT)
        1. 8.3.13.1 Shunt Current Sensing
        2. 8.3.13.2 Inductor DCR Current Sensing
      14. 8.3.14 Hiccup Mode Current Limiting
      15. 8.3.15 High-Side and Low-Side Gate Drivers (HO, LO)
      16. 8.3.16 Output Configurations (CNFG)
      17. 8.3.17 Single-Output Dual-Phase Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
      2. 8.4.2 Pulse Frequency Modulation and Synchronization (PFM/SYNC)
      3. 8.4.3 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Power Train Components
        1. 9.1.1.1 Buck Inductor
        2. 9.1.1.2 Output Capacitors
        3. 9.1.1.3 Input Capacitors
        4. 9.1.1.4 Power MOSFETs
        5. 9.1.1.5 EMI Filter
        6. 9.1.1.6 Active EMI Filter
      2. 9.1.2 Error Amplifier and Compensation
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – High-Efficiency 2.1-MHz Synchronous Buck Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2  Custom Design With Excel Quickstart Tool
          3. 9.2.1.2.3  Buck Inductor
          4. 9.2.1.2.4  Current-Sense Resistance
          5. 9.2.1.2.5  Output Capacitors
          6. 9.2.1.2.6  Input Capacitors
          7. 9.2.1.2.7  Frequency Set Resistor
          8. 9.2.1.2.8  Feedback Resistors
          9. 9.2.1.2.9  Compensation Components
          10. 9.2.1.2.10 Active EMI Components
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – High Efficiency 440-kHz Synchronous Buck Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Design 3 – Dual-Phase 400-kHz 20-A Synchronous Buck Regulator
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Power Stage Layout
        2. 9.4.1.2 Gate-Drive Layout
        3. 9.4.1.3 PWM Controller Layout
        4. 9.4.1.4 Active EMI Layout
        5. 9.4.1.5 Thermal Design and Layout
        6. 9.4.1.6 Ground Plane Design
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
        1. 10.2.1.1 PCB Layout Resources
        2. 10.2.1.2 Thermal Design Resources
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.3 Thermal Shutdown

The LM25149-Q1 includes an internal junction temperature monitor. If the temperature exceeds 175°C (typical), thermal shutdown occurs. When entering thermal shutdown, the device:

  1. Turns off the high-side and low-side MOSFETs.
  2. PG/SYNCOUT switches low.
  3. Turns off the VCC regulator.
  4. Initiates a soft-start sequence when the die temperature decreases by the thermal shutdown hysteresis of 15°C (typical).
This is a non-latching protection and as such, the device cycles into and out of thermal shutdown if the fault persists.