ZHCSLB7B April   2020  – July 2022 IWR6843AOP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
      1. 7.2.1 Pin Functions - Digital and Analog [ALP Package]
    3. 7.3 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Supply Specifications
    6. 8.6  Power Consumption Summary
    7. 8.7  RF Specification
    8. 8.8  CPU Specifications
    9. 8.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
    10. 8.10 Timing and Switching Characteristics
      1. 8.10.1  Antenna Radiation Patterns
        1. 8.10.1.1 Antenna Radiation Patterns for Receiver
        2. 8.10.1.2 Antenna Radiation Patterns for Transmitter
      2. 8.10.2  Antenna Positions
      3. 8.10.3  Power Supply Sequencing and Reset Timing
      4. 8.10.4  Input Clocks and Oscillators
        1. 8.10.4.1 Clock Specifications
      5. 8.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.10.5.1 Peripheral Description
        2. 8.10.5.2 MibSPI Transmit and Receive RAM Organization
          1. 8.10.5.2.1 SPI Timing Conditions
          2. 8.10.5.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
          3. 8.10.5.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) (1) (1) (1)
        3. 8.10.5.3 SPI Peripheral Mode I/O Timings
          1. 8.10.5.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (1) (1)
        4. 8.10.5.4 Typical Interface Protocol Diagram (Peripheral Mode)
      6. 8.10.6  LVDS Interface Configuration
        1. 8.10.6.1 LVDS Interface Timings
      7. 8.10.7  General-Purpose Input/Output
        1. 8.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 8.10.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 8.10.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 8.10.9  Serial Communication Interface (SCI)
        1. 8.10.9.1 SCI Timing Requirements
      10. 8.10.10 Inter-Integrated Circuit Interface (I2C)
        1. 8.10.10.1 I2C Timing Requirements (1)
      11. 8.10.11 Quad Serial Peripheral Interface (QSPI)
        1. 8.10.11.1 QSPI Timing Conditions
        2. 8.10.11.2 Timing Requirements for QSPI Input (Read) Timings (1) (1)
        3. 8.10.11.3 QSPI Switching Characteristics
      12. 8.10.12 ETM Trace Interface
        1. 8.10.12.1 ETMTRACE Timing Conditions
        2. 8.10.12.2 ETM TRACE Switching Characteristics
      13. 8.10.13 Data Modification Module (DMM)
        1. 8.10.13.1 DMM Timing Requirements
      14. 8.10.14 JTAG Interface
        1. 8.10.14.1 JTAG Timing Conditions
        2. 8.10.14.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 8.10.14.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
        1. 9.3.1.1 Clock Subsystem
        2. 9.3.1.2 Transmit Subsystem
        3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Processor Subsystem
      3. 9.3.3 Host Interface
      4. 9.3.4 Main Subsystem Cortex-R4F
      5. 9.3.5 DSP Subsystem
      6. 9.3.6 Hardware Accelerator
    4. 9.4 Other Subsystems
      1. 9.4.1 ADC Channels (Service) for User Application
        1. 9.4.1.1 GP-ADC Parameter
  10. 10Monitoring and Diagnostics
    1. 10.1 Monitoring and Diagnostic Mechanisms
      1. 10.1.1 Error Signaling Module
  11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Reference Schematic
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALP|180
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1 Related Products

For information about other devices in this family of products or related products see the links that follow.

    mmWave sensorsTI’s mmWave sensors rapidly and accurately sense range, angle and velocity with less power using the smallest footprint mmWave sensor portfolio for industrial applications.
    mmWave IWRThe Texas Instruments IWRxxxx family of mmWave Sensors are highly integrated and built on RFCMOS technology operating in 76- to 81-GHz or 60- to 64-GHz frequency band. The devices have a closed-loop PLL for precise and linear chirp synthesis, includes a built-in radio processor (BIST) for RF calibration and safety monitoring. The devices have a very small-form factor, low power consumption, and are highly accurate. Industrial applications from long range to ultra short range can be realized using these devices.
    Companion products Review products that are frequently purchased or used in conjunction with this product.
    Reference designs The IWR6843 TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs, and design files to speed your time to market. Search and download designs at ti.com/tidesigns.