SLLSEC3F September   2012  – April 2016 ISO7631FC , ISO7631FM , ISO7641FC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VCC1 and VCC2 at 5 V ± 10%
    6. 6.6  Electrical Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    7. 6.7  Electrical Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 2.7 V (ISO7631FM Only)
    10. 6.10 Power Dissipation Characteristics
    11. 6.11 Supply Current Characteristics: VCC1 and VCC2 at 5 V ± 10%
    12. 6.12 Supply Current Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    13. 6.13 Supply Current Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    14. 6.14 Supply Current Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    15. 6.15 Supply Current Characteristics: VCC1 and VCC2 at 2.7 V (ISO7631FM Only) Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
    16. 6.16 Switching Characteristics: VCC1 and VCC2 at 5 V ± 10%
    17. 6.17 Switching Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%
    18. 6.18 Switching Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%
    19. 6.19 Switching Characteristics: VCC1 and VCC2 at 3.3 V ± 10%
    20. 6.20 Switching Characteristics: VCC1 and VCC2 at 2.7 V Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
    21. 6.21 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Package Insulation and Safety-Related Specifications IEC and for DW-16 Package from IEC Package Insulation and Safety-Related Specifications for DW-16 Package section.
        1. 8.3.1.1 Safety Limiting Values
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

See (1)
MIN MAX UNIT
VCC1
VCC2(2)		 Supply voltage –0.5 6 V
Voltage INx, OUTx, ENx –0.5 6(3) V
IO Output current ±15 mA
TJ Maximum junction temperature 150 °C
TSTG Storage temperature –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
(3) Maximum voltage must not exceed 6 V.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
Machine model (MM), JEDEC JESD22-A115-A ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC1, VCC2 Supply voltage M-Grade 2.7 5.5 V
C-Grade 3 5.5
IOH High-level output current –4 mA
IOL Low-level output current 4 mA
VIH High-level input voltage 2 5.5 V
VIL Low-level input voltage 0 0.8 V
tui Input pulse duration M-Grade: ≥3-V Operation 6.67 ns
M-Grade: <3-V Operation 10
C-Grade: ≥3-V Operation 40
1 / tui Signaling rate M-Grade: ≥3-V Operation 0 150 Mbps
M-Grade: <3-V Operation 0 100
C-Grade: ≥3-V Operation 0 25
TJ Junction temperature –40 136 °C
TA Ambient temperature –40 25 125 °C

6.4 Thermal Information

THERMAL METRIC(1) ISO76x1Fx UNIT
DW (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 77.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 40.4 °C/W
RθJB Junction-to-board thermal resistance 42.2 °C/W
ψJT Junction-to-top characterization parameter 15 °C/W
ψJB Junction-to-board characterization parameter 41.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics: VCC1 and VCC2 at 5 V ± 10%

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
VOH High-level output voltage IOH = –4 mA; see Figure 16 VCCO(1) – 0.8 4.8 VCCO – 0.8 4.7 V
IOH = –20 μA; see Figure 16 VCCO – 0.1 5 VCCO – 0.1 5
VOL Low-level output voltage IOL = 4 mA; see Figure 16 0.2 0.4 0.3 0.5 V
IOL = 20 μA; see Figure 16 0 0.1 0 0.1
VI(HYS) Input threshold voltage hysteresis 450 450 mV
IIH High-level input current VIH = VCC at INx or ENx 10 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10 -10 μA
CMTI Common-mode transient immunity VI = VCCI (1) or 0 V; see Figure 19 25 75 25 75 kV/μs
(1) VCCI = Input-side supply voltage; VCCO = Output-side supply voltage

6.6 Electrical Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%

VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
VOH High-level output voltage IOH = –4 mA; see Figure 16 OUTx on VCC1 (5 V) side VCC1 – 0.8 4.8 VCC1 – 0.8 4.7 V
OUTx on VCC2 (3.3 V) side VCC2 - 0.4 3 VCC2 - 0.6 2.9
IOH = –20 μA; see Figure 16 OUTx on VCC1 (5 V) side VCC1 – 0.1 5 VCC1 – 0.1 5
OUTx on VCC2 (3.3 V) side VCC2 – 0.1 3.3 VCC2 – 0.1 3.3
VOL Low-level output voltage IOL = 4 mA; see Figure 16 0.2 0.4 0.3 0.5 V
IOL = 20 μA; see Figure 16 0 0.1 0 0.1
VI(HYS) Input threshold voltage hysteresis 430 430 mV
IIH High-level input current VIH = VCC at INx or ENx 10 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx -10 -10 μA
CMTI Common-mode transient immunity VI = VCCI (1) or 0 V; see Figure 19 25 50 25 50 kV/μs
(1) VCCI = Input-side supply voltage

6.7 Electrical Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%

VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
VOH High-level output voltage IOH = –4 mA; see Figure 16 OUTx on VCC1 (3.3 V) side VCC1–0.4 3 VCC1-0.6 2.9 V
OUTx on VCC2 (5 V) side VCC2–0.8 4.8 VCC2–0.8 4.7
IOH = –20 μA; see Figure 16 OUTx on VCC1 (3.3 V) side VCC1–0.1 3.3 VCC1–0.1 3.3
OUTx on VCC2 (5 V) side VCC2–0.1 5 VCC2–0.1 5
VOL Low-level output voltage IOL = 4 mA; see Figure 16 0.2 0.4 0.3 0.5 V
IOL = 20 μA; see Figure 16 0 0.1 0 0.1
VI(HYS) Input threshold voltage hysteresis 430 430 mV
IIH High-level input current VIH = VCC at INx or ENx 10 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx -10 -10 μA
CMTI Common-mode transient immunity VI = VCCI (1) or 0 V; see Figure 19 25 50 25 50 kV/μs
(1) VCCI = Input-side supply voltage

6.8 Electrical Characteristics: VCC1 and VCC2 at 3.3 V ± 10%

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
VOH High-level output voltage IOH = –4 mA; see Figure 16 VCCO(1) – 0.4 3 VCCO – 0.6 2.9 V
IOH = –20 μA; see Figure 16 VCCO – 0.1 3.3 VCCO – 0.1 3.3
VOL Low-level output voltage IOL = 4 mA; see Figure 16 0.2 0.4 0.3 0.5 V
IOL = 20 μA; see Figure 16 0 0.1 0 0.1
VI(HYS) Input threshold voltage hysteresis 425 425 mV
IIH High-level input current VIH = VCC at INx or ENx 10 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx -10 -10 μA
CMTI Common-mode transient immunity VI = VCCI (1) or 0 V; see Figure 19 25 50 25 50 kV/μs
(1) VCCI = Input-side supply voltage; VCCO = Output-side supply voltage

6.9 Electrical Characteristics: VCC1 and VCC2 at 2.7 V (ISO7631FM Only)

VCC1 and VCC2 at 2.7 V(1) (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 16 VCCO(2) – 0.5 2.4 V
IOH = –20 μA; see Figure 16 VCCO – 0.1 2.7
VOL Low-level output voltage IOL = 4 mA; see Figure 16 0.2 0.4 V
IOL = 20 μA; see Figure 16 0 0.1
VI(HYS) Input threshold voltage hysteresis 350 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx -10 μA
CMTI Common-mode transient immunity VI = VCCI (2) or 0 V; see Figure 19 25 50 kV/μs
(1) Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
(2) VCCI = Input-side supply voltage; VCCO = Output-side supply voltage

6.10 Power Dissipation Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PD Maximum Device Power Dissipation VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF
Input a 75 MHz 50% duty cycle square wave		 399 mW

6.11 Supply Current Characteristics: VCC1 and VCC2 at 5 V ± 10%

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
ISO7631F
ICC1 Disable EN1 = EN2 = 0 V 2.5 4 1.1 1.9 mA
ICC2 3.7 5.4 1.5 2.6 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 2.6 4.1 1.8 2.7 mA
ICC2 3.8 5.5 2.6 3.9 mA
ICC1 10 Mbps 3.3 4.5 2.7 3.7 mA
ICC2 4.9 6.6 3.9 5.3 mA
ICC1 25 Mbps 4.5 6 4.1 5.4 mA
ICC2 6.8 9 5.9 7.8 mA
ICC1 150 Mbps 15 19.5 Not Applicable mA
ICC2 22 30 Not Applicable mA
ISO7641F
ICC1 Disable EN1 = EN2 = 0 V 1.2 2.1 mA
ICC2 1.6 2.6 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 1.8 2.8 mA
ICC2 3.1 4.2 mA
ICC1 10 Mbps 3 4 mA
ICC2 4.9 6.1 mA
ICC1 25 Mbps 4.8 6 mA
ICC2 7.7 9.5 mA

6.12 Supply Current Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%

VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
ISO7631F
ICC1 Disable EN1 = EN2 = 0 V 2.5 4 1.1 1.9 mA
ICC2 2.7 3.7 0.7 1.3 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 2.6 4.1 1.8 2.7 mA
ICC2 2.8 3.8 1.8 2.6 mA
ICC1 10 Mbps 3.3 4.5 2.7 3.7 mA
ICC2 3.5 4.6 2.6 3.5 mA
ICC1 25 Mbps 4.5 6 4.1 5.4 mA
ICC2 4.7 5.9 3.8 5 mA
ICC1 150 Mbps 15 19.5 Not Applicable mA
ICC2 14.6 19 Not Applicable mA
ISO7641F
ICC1 Disable EN1 = EN2 = 0 V 1.2 2.1 mA
ICC2 0.8 1.3 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 1.8 2.8 mA
ICC2 2 2.9 mA
ICC1 10 Mbps 3 4 mA
ICC2 3.2 4.1 mA
ICC1 25 Mbps 4.8 6 mA
ICC2 5.1 7 mA

6.13 Supply Current Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%

VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
ISO7631F
ICC1 Disable EN1 = EN2 = 0 V 1.8 2.8 0.6 1.1 mA
ICC2 3.7 5.4 1.5 2.6 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 1.9 2.9 1.2 1.8 mA
ICC2 3.8 5.5 2.6 3.9 mA
ICC1 10 Mbps 2.4 3.4 1.8 2.6 mA
ICC2 4.9 6.6 3.9 5.3 mA
ICC1 25 Mbps 3.2 4.2 2.7 3.6 mA
ICC2 6.8 9 5.9 7.8 mA
ICC1 150 Mbps 9.3 12.5 Not Applicable mA
ICC2 22 30 Not Applicable mA
ISO7641F
ICC1 Disable EN1 = EN2 = 0 V 0.7 1.1 mA
ICC2 1.6 2.6 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 1.2 1.9 mA
ICC2 3.1 4.2 mA
ICC1 10 Mbps 2 2.8 mA
ICC2 4.9 6.1 mA
ICC1 25 Mbps 3.1 4 mA
ICC2 7.7 9.5 mA

6.14 Supply Current Characteristics: VCC1 and VCC2 at 3.3 V ± 10%

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
ISO7631F
ICC1 Disable EN1 = EN2 = 0 V 1.8 2.8 0.6 1.1 mA
ICC2 2.7 3.7 0.7 1.3 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 1.9 2.9 1.2 1.8 mA
ICC2 2.8 3.8 1.8 2.6 mA
ICC1 10 Mbps 2.4 3.4 1.8 2.6 mA
ICC2 3.5 4.6 2.6 3.5 mA
ICC1 25 Mbps 3.2 4.2 2.7 3.6 mA
ICC2 4.7 5.9 3.8 5 mA
ICC1 150 Mbps 9.3 12.5 Not Applicable mA
ICC2 14.6 19 Not Applicable mA
ISO7641F
ICC1 Disable EN1 = EN2 = 0 V 0.7 1.1 mA
ICC2 0.8 1.3 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 1.2 1.9 mA
ICC2 2 2.9 mA
ICC1 10 Mbps 2 2.8 mA
ICC2 3.2 4.1 mA
ICC1 25 Mbps 3.1 4 mA
ICC2 5.1 7 mA

6.15 Supply Current Characteristics: VCC1 and VCC2 at 2.7 V (ISO7631FM Only) (1)

(1) Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade UNIT
MIN TYP MAX
ISO7631F
ICC1 Disable EN1 = EN2 = 0 V 1.5 2.4 mA
ICC2 2.2 3.2 mA
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 1.6 2.5 mA
ICC2 2.3 3.2 mA
ICC1 10 Mbps 2 2.9 mA
ICC2 3 3.9 mA
ICC1 25 Mbps 2.7 3.7 mA
ICC2 3.9 4.9 mA
ICC1 100 Mbps 5.7 6.8 mA
ICC2 8.6 12 mA

6.16 Switching Characteristics: VCC1 and VCC2 at 5 V ± 10%

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
ISO7631F, ISO7641F
tPLH, tPHL Propagation delay time See Figure 16 3.5 7 10.5 11 17 28 ns
PWD(1) Pulse width distortion |tPHL – tPLH| See Figure 16 2 3 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2 3 ns
Opposite-direction Channels 3 4
tsk(pp)(3) Part-to-part skew time 4.5 13 ns
tr Output signal rise time See Figure 16 1.6 2.8 ns
tf Output signal fall time See Figure 16 1 2.9 ns
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 17 5 16 8 20 ns
tPLZ Disable Propagation Delay, low-to-high impedance output See Figure 17 5 16 7 20 ns
tPZH Enable Propagation Delay, high impedance-to-high output See Figure 17 4 16 11000 22000(4) ns
tPZL Enable Propagation Delay, high impedance-to-low output See Figure 17 4 16 8 20 ns
tfs Fail-safe output delay time from input data or power loss See Figure 18 9.5 9 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.
(4) The enable signal rate for C-grade devices should be ≤ 45 Kbps.

6.17 Switching Characteristics: VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10%

VCC1 at 5 V ± 10% and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
ISO7631F, ISO7641F
tPLH, tPHL Propagation delay time See Figure 16 4 8 13 11 18 32 ns
PWD(1) Pulse width distortion |tPHL – tPLH| See Figure 16 2 3.5 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2.5 4.5 ns
Opposite-direction Channels 3.5 5.5
tsk(pp)(3) Part-to-part skew time 6 15 ns
tr Output signal rise time See Figure 16 2 3.6 ns
tf Output signal fall time See Figure 16 1.2 3.3 ns
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 17 6.5 17 9 20 ns
tPLZ Disable Propagation Delay, low-to-high impedance output See Figure 17 6.5 17 8 20 ns
tPZH Enable Propagation Delay, high impedance-to-high output See Figure 17 5.5 17 11000 22000(4) ns
tPZL Enable Propagation Delay, high impedance-to-low output See Figure 17 5.5 17 10 30 ns
tfs Fail-safe output delay time from input data or power loss See Figure 18 9.5 8.5 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.
(4) The enable signal rate for C-grade devices should be ≤ 45 Kbps.

6.18 Switching Characteristics: VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10%

VCC1 at 3.3 V ± 10% and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
ISO7631F, ISO7641F
tPLH, tPHL Propagation delay time See Figure 16 4 7.5 12.5 11 18.5 32 ns
PWD(1) Pulse width distortion |tPHL – tPLH| See Figure 16 2 2.5 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2.5 4.5 ns
Opposite-direction Channels 3.5 5.5
tsk(pp)(3) Part-to-part skew time 6 15 ns
tr Output signal rise time See Figure 16 1.7 2.9 ns
tf Output signal fall time See Figure 16 1.1 2.9 ns
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 17 5.5 17 8 20 ns
tPLZ Disable Propagation Delay, low-to-high impedance output See Figure 17 5.5 17 7 20 ns
tPZH Enable Propagation Delay, high impedance-to-high output See Figure 17 4.5 17 11000 22000(4) ns
tPZL Enable Propagation Delay, high impedance-to-low output See Figure 17 4.5 17 8 30 ns
tfs Fail-safe output delay time from input data or power loss See Figure 18 9.5 7.5 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.
(4) The enable signal rate for C-grade devices should be ≤ 45 Kbps.

6.19 Switching Characteristics: VCC1 and VCC2 at 3.3 V ± 10%

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade C-Grade UNIT
MIN TYP MAX MIN TYP MAX
ISO7631F, ISO7641F
tPLH, tPHL Propagation delay time See Figure 16 4 8.5 14 12 23 35 ns
PWD(1) Pulse width distortion |tPHL – tPLH| See Figure 16 2 3 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 3 5 ns
Opposite-direction Channels 4 6
tsk(pp)(3) Part-to-part skew time 6.5 16 ns
tr Output signal rise time See Figure 16 2 3.7 ns
tf Output signal fall time See Figure 16 1.3 3.4 ns
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 17 6.5 17 9 20 ns
tPLZ Disable Propagation Delay, low-to-high impedance output See Figure 17 6.5 17 8 20 ns
tPZH Enable Propagation Delay, high impedance-to-high output See Figure 17 5.5 17 11000 22000(4) ns
tPZL Enable Propagation Delay, high impedance-to-low output See Figure 17 5.5 17 10 30 ns
tfs Fail-safe output delay time from input data or power loss See Figure 18 9.2 7.5 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.
(4) The enable signal rate for C-grade devices should be ≤ 45 Kbps.

6.20 Switching Characteristics: VCC1 and VCC2 at 2.7 V (2)

(2)Only M-Grade devices are recommended for operation down to 2.7 V supplies. For 2.7 V-operation, max data rate is 100 Mbps.
VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS M-Grade
MIN TYP MAX UNIT
ISO7631F, ISO7641F
tPLH, tPHL Propagation delay time See Figure 16 5 8 16 ns
PWD(1) Pulse width distortion |tPHL – tPLH| See Figure 16 2.5 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 4 ns
Opposite-direction Channels 5
tsk(pp)(3) Part-to-part skew time 8 ns
tr Output signal rise time See Figure 16 2.3 ns
tf Output signal fall time See Figure 16 1.8 ns
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 17 8 18 ns
tPLZ Disable Propagation Delay, low-to-high impedance output See Figure 17 8 18 ns
tPZH Enable Propagation Delay, high impedance-to-high output See Figure 17 7 18 ns
tPZL Enable Propagation Delay, high impedance-to-low output See Figure 17 7 18 ns
tfs Fail-safe output delay time from input data or power loss See Figure 18 8.5 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.

6.21 Typical Characteristics

ISO7631FM ISO7631FC ISO7641FC G200_ISO7631FM_ICC_Per_Ch.png Figure 1. ISO7631FM Supply Current Per Channel
vs Data Rate
ISO7631FM ISO7631FC ISO7641FC G202_ISO7631FC_ICC_Per_Ch.png Figure 3. ISO7631FC Supply Current Per Channel
vs Data Rate
ISO7631FM ISO7631FC ISO7641FC G102_ISO7641FC_ICC_Per_Ch.png Figure 5. ISO7641FC Supply Current Per Channel
vs Data Rate
ISO7631FM ISO7631FC ISO7641FC G005_SLLSE89.png Figure 7. M-Grade High-Level Output Voltage
vs High-Level Output Current
ISO7631FM ISO7631FC ISO7641FC G104_C-Grade_VOH_vs_IOH.png Figure 9. C-Grade High-Level Output Voltage
vs High-Level Output Current
ISO7631FM ISO7631FC ISO7641FC G007_SLLSE89.png Figure 11. VCC Undervoltage Threshold
vs Free Air Temperature
ISO7631FM ISO7631FC ISO7641FC G106_C-Grade_Prop-Delay_vs_Temp.png Figure 13. C-Grade Propagation Delay Time
vs Free Air Temperature
ISO7631FM ISO7631FC ISO7641FC G107_C-Grade_Output-Jitter_vs_Data-Rate.png Figure 15. C-Grade Output Jitter vs Data Rate
ISO7631FM ISO7631FC ISO7641FC G201_ISO7631FM_ICC_All_Ch.png Figure 2. ISO7631FM Supply Current For All Channels
vs Data Rate
ISO7631FM ISO7631FC ISO7641FC G203_ISO7631FC_ICC_All_Ch.png Figure 4. ISO7631FC Supply Current For All Channels
vs Data Rate
ISO7631FM ISO7631FC ISO7641FC G103_ISO7641FC_ICC_All_Ch.png Figure 6. ISO7641FC Supply Current For All Channels
vs Data Rate
ISO7631FM ISO7631FC ISO7641FC G006_SLLSE89.png Figure 8. M-Grade Low-Level Output Voltage
vs Low-Level Output Current
ISO7631FM ISO7631FC ISO7641FC G105_C-Grade_VOL_vs_IOL.png Figure 10. C-Grade Low-Level Output Voltage
vs Low-Level Output Current
ISO7631FM ISO7631FC ISO7641FC G008_SLLSE89.png Figure 12. M-Grade Propagation Delay Time
vs Free Air Temperature
ISO7631FM ISO7631FC ISO7641FC G009_SLLSE89.gif Figure 14. M-Grade Output Jitter vs Data Rate