ZHCSK04B july   2019  – august 2020 ISO7021

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6.   Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics 5V Supply
    10. 6.10 Supply Current Characteristics 5V Supply
    11. 6.11 Electrical Characteristics 3.3V Supply
    12. 6.12 Supply Current Characteristics 3.3V Supply
    13. 6.13 Electrical Characteristics 2.5V Supply
    14. 6.14 Supply Current Characteristics 2.5V Supply
    15. 6.15 Electrical Characteristics 1.8V Supply
    16. 6.16 Supply Current Characteristics 1.8V Supply
    17. 6.17 Switching Characteristics
  9. Parameter Measurement Information
  10. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Refresh
      2. 8.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  11. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Insulation Lifetime
      2. 9.1.2 Intrinsic Safety
        1. 9.1.2.1 Schedule of Limitations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  12. 10Power Supply Recommendations
  13. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  14. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  15. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 超低功耗
    • 每通道静态电流为 4.8μA (3.3V)
    • 100kbps 时的每通道电流为 15μA (3.3V)
    • 1Mbps 时的每通道电流为 120μA (3.3V)
  • 稳健可靠的隔离栅
    • 预计寿命超过 100 年
    • 隔离额定值为 3000VRMS
    • CMTI 典型值为 ±100kV/μs
  • 宽电源电压范围:1.71V 到 1.89V 和 2.25V 到 5.5V
  • 宽温度范围:–55°C 至 +125°C
  • 小型 8-SOIC 封装 (8-D)
  • 信令速率:高达 4Mbps
  • 默认输出高电平 (ISO7021) 和低电平 (ISO7021F) 选项
  • 优异的电磁兼容性 (EMC)
    • 系统级 ESD、EFT 和浪涌抗扰性
    • 在整个隔离栅具有 ±8kV IEC 61000-4-2 接触放电保护
    • 超低干扰 (EMI)
  • 安全相关认证(计划)
    • DIN V VDE 0884-11:2017-01
    • UL 1577 组件认证计划
    • IEC 60950-1、IEC 62368-1、IEC 61010-1、IEC60601-1 和 GB 4943.1-2011 认证
    • IECEx(IEC 60079-0 和 IEC 60079-11)和 ATEX(EN IEC60079-0 和 EN 60079-11)