ZHCSK04B
july 2019 – august 2020
ISO7021
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
Device Comparison Table
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Power Ratings
6.6
Insulation Specifications
6.7
Safety-Related Certifications
6.8
Safety Limiting Values
6.9
Electrical Characteristics 5V Supply
6.10
Supply Current Characteristics 5V Supply
6.11
Electrical Characteristics 3.3V Supply
6.12
Supply Current Characteristics 3.3V Supply
6.13
Electrical Characteristics 2.5V Supply
6.14
Supply Current Characteristics 2.5V Supply
6.15
Electrical Characteristics 1.8V Supply
6.16
Supply Current Characteristics 1.8V Supply
6.17
Switching Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Refresh
8.3.2
Electromagnetic Compatibility (EMC) Considerations
8.4
Device Functional Modes
8.4.1
Device I/O Schematics
9
Application and Implementation
9.1
Application Information
9.1.1
Insulation Lifetime
9.1.2
Intrinsic Safety
9.1.2.1
Schedule of Limitations
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
PCB Material
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
D|8
MSOI002K
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsk04b_oa
zhcsk04b_pm
12.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。