ZHCSK04B july   2019  – august 2020 ISO7021

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6.   Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics 5V Supply
    10. 6.10 Supply Current Characteristics 5V Supply
    11. 6.11 Electrical Characteristics 3.3V Supply
    12. 6.12 Supply Current Characteristics 3.3V Supply
    13. 6.13 Electrical Characteristics 2.5V Supply
    14. 6.14 Supply Current Characteristics 2.5V Supply
    15. 6.15 Electrical Characteristics 1.8V Supply
    16. 6.16 Supply Current Characteristics 1.8V Supply
    17. 6.17 Switching Characteristics
  9. Parameter Measurement Information
  10. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Refresh
      2. 8.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  11. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Insulation Lifetime
      2. 9.1.2 Intrinsic Safety
        1. 9.1.2.1 Schedule of Limitations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  12. 10Power Supply Recommendations
  13. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  14. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  15. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Schedule of Limitations

These components are certified to comply with IEC 60079-0, Edition 7, IEC 60079-11, Edition 6, EN IEC60079-0:2018 and EN 60070-11:2012. When one of these components is used in an equipment, the component is to be soldered on a PCB inside a suitable enclosure and re-evaluated as an equipment. The operating temperature range of these components is -55°C to +85°C. The creepage and clearance distances across the isolating component have been evaluated, but the distance to other circuitry remain the responsibility of the user of the final equipment.

This assembly is an isolating component between separate intrinsically safe circuits. The assembly must be connected to suitably certified intrinsically safe circuits considering the entity parameters and temperature ratings in the application scenario shown in Table 9-1

Table 9-1 Entity Parameters and Temperature Ratings
APPLICATION ENTITY PARAMETERS SIDE 1 ENTITY PARAMETERS SIDE 2 AMBIENT TEMPERATURE RANGE MAXIMUM COMPONENT TEMPERATURE
IS to IS: Case 1 Ui = 50 V Ui = 50 V -55°C to +85°C 183°C
Ii = 300 mA Ii = 300 mA
Pi = 1.3 W Pi = 1.3 W
Li = 0 H Li = 0 H
Ci = 4 pF Ci = 4 pF