ZHCSCL3 JUNE   2014 DS90UH925AQ-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  DC Electrical Characteristics
    6. 7.6  AC Electrical Characteristics
    7. 7.7  Recommended Timing for the Serial Control Bus
    8. 7.8  DC and AC Serial Control Bus Characteristics
    9. 7.9  AC Timing Diagrams and Test Circuits
    10. 7.10 Switching Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Functional Block Diagram
      2. 8.1.2 Feature Description
        1. 8.1.2.1  High Speed Forward Channel Data Transfer
        2. 8.1.2.2  Low Speed Back Channel Data Transfer
        3. 8.1.2.3  Common Mode Filter Pin (CMF)
        4. 8.1.2.4  Video Control Signal Filter
        5. 8.1.2.5  Backward Compatible Mode
        6. 8.1.2.6  EMI Reduction Features
          1. 8.1.2.6.1 Input SSC Tolerance (SSCT)
        7. 8.1.2.7  LVCMOS VDDIO Option
        8. 8.1.2.8  Power Down (PDB)
        9. 8.1.2.9  Remote Auto Power Down Mode
        10. 8.1.2.10 Input PCLK Loss Detect
        11. 8.1.2.11 Serial Link Fault Detect
        12. 8.1.2.12 Pixel Clock Edge Select (RFB)
        13. 8.1.2.13 Low Frequency Optimization (LFMODE)
        14. 8.1.2.14 Interrupt Pins - Funtional Description and Usage (INTB, REM_INTB)
        15. 8.1.2.15 GPIO[3:0] and GPO_REG[7:4]
        16. 8.1.2.16 I2S Transmitting
          1. 8.1.2.16.1 Secondary I2S Channel
          2. 8.1.2.16.2 HDCP
      3. 8.1.3 Built In Self Test (BIST)
        1. 8.1.3.1 BIST Configuration and Status
        2. 8.1.3.2 Forward Channel and Back Channel Error Checking
      4. 8.1.4 Internal Pattern Generation
      5. 8.1.5 Change Summary from DS90UH925Q
    2. 8.2 Device Functional Modes
      1. 8.2.1 Configuration Select (MODE_SEL)
      2. 8.2.2 HDCP Repeater
        1. 8.2.2.1 Repeater Configuration
        2. 8.2.2.2 Repeater Connections
    3. 8.3 Programming
      1. 8.3.1 Serial Control Bus
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Typical Application Connection
        2. 9.2.2.2 Power Up Requirements and PDB Pin
        3. 9.2.2.3 CML Interconnect Guidelines
        4. 9.2.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 Trademarks

All other trademarks are the property of their respective owners.

12.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。