ZHCSKE4C october   2016  – december 2020 DS280MB810

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements – Serial Management Bus Interface
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Data Path Operation
      2. 8.3.2 AC-coupled Receiver Inputs
      3. 8.3.3 Signal Detect
      4. 8.3.4 2-Stage CTLE
      5. 8.3.5 Driver DC Gain Control
      6. 8.3.6 2x2 Cross-point Switch
      7. 8.3.7 Configurable SMBus Address
    4. 8.4 Device Functional Modes
      1. 8.4.1 SMBus Slave Mode Configuration
      2. 8.4.2 SMBus Master Mode Configuration (EEPROM Self Load)
    5. 8.5 Programming
      1. 8.5.1 Transfer of Data with the SMBus Interface
    6. 8.6 Register Maps
      1. 8.6.1 Register Types: Global, Shared, and Channel
      2. 8.6.2 Global Registers: Channel Selection and ID Information
      3. 8.6.3 Shared Registers
      4. 8.6.4 Channel Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Backplane and Mid-Plane Reach Extension
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Front-Port Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Pattern Generator Characteristics
        2. 9.2.3.2 Equalizing Moderate Pre-Channel Loss
        3. 9.2.3.3 Equalizing High Pre-Channel Loss
        4. 9.2.3.4 Equalizing High Pre-Channel Loss and Moderate Post-Channel Loss
    3. 9.3 Initialization Set Up
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
      1. 11.2.1 Stripline Example
      2. 11.2.2 Microstrip Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

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6 Pin Configuration and Functions

GUID-5034D193-404F-4C18-946E-7BDABB472171-low.gif Figure 6-1 Top View
Table 6-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
High Speed Differential I/O
RX0P C15 Input Inverting and non-inverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs are AC coupled with 220 nF capacitors assembled on the package substrate.
RX0N B15 Input
RX1P B13 Input Inverting and non-inverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs are AC coupled with 220 nF capacitors assembled on the package substrate.
RX1N A13 Input
RX2P B11 Input Inverting and non-inverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs are AC coupled with 220 nF capacitors assembled on the package substrate.
RX2N A11 Input
RX3P B9 Input Inverting and non-inverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs are AC coupled with 220 nF capacitors assembled on the package substrate.
RX3N A9 Input
RX4P B7 Input Inverting and non-inverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs are AC coupled with 220 nF capacitors assembled on the package substrate.
RX4N A7 Input
RX5P B5 Input Inverting and non-inverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs are AC coupled with 220 nF capacitors assembled on the package substrate.
RX5N A5 Input
RX6P B3 Input Inverting and non-inverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs are AC coupled with 220 nF capacitors assembled on the package substrate.
RX6N A3 Input
RX7P C1 Input Inverting and non-inverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs are AC coupled with 220 nF capacitors assembled on the package substrate.
RX7N B1 Input
TX0P G15 Output Inverting and non-inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs.
TX0N H15 Output
TX1P H13 Output Inverting and non-inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs.
TX1N J13 Output
TX2P H11 Output Inverting and non-inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs.
TX2N J11 Output
TX3P H9 Output Inverting and non-inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs.
TX3N J9 Output
TX4P H7 Output Inverting and non-inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs.
TX4N J7 Output
TX5P H5 Output Inverting and non-inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs.
TX5N J5 Output
TX6P H3 Output Inverting and non-inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs.
TX6N J3 Output
TX7P G1 Output Inverting and non-inverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs.
TX7N H1 Output
Calibration Clock Pins (For Supporting Upgrade Path to Pin-Compatible Retimer Device)
CAL_CLK_IN E1 Input 25-MHz (±100 PPM) 2.5-V single-ended clock from external oscillator. No stringent phase noise or jitter requirements on this clock. A 25-MHz input clock is only required if there is a need to support a future upgrade to the pin-compatible Retimer device. If there is no need to support a future upgrade to a pin-compatible Retimer device, then a 25-MHz clock is not required. This input pin has a weak active pull down and can be left floating if the CAL_CLK feature is not required.
CAL_CLK_
OUT		 E15 Output 2.5-V buffered replica of calibration clock input (pin E1) for connecting multiple devices in a daisy-chained fashion.
System Management Bus (SMBus) Pins
ADDR0 D13 Input, 4-Level 4-level strap pins used to set the SMBus address of the device. The pin state is read on power-up. The multi-level nature of these pins allows for 16 unique device addresses, see Table 8-1. The four strap options include:
0: 1 kΩ to GND
R: 10 kΩ to GND
F: Float
1: 1 kΩ to VDD
ADDR1 E13 Input, 4-Level
EN_SMB E3 Input, 4-Level 4-level 2.5-V input used to select between SMBus master mode (float) and SMBus slave mode (high). The four defined levels are:
0: 1 kΩ to GND - RESERVED
R: 10 kΩ to GND - RESERVED, TI test mode
F: Float - SMBus master mode
1: 1 kΩ to VDD - SMBus slave mode
SDA E12 I/O, 3.3 V LVCMOS, Open Drain SMBus data input or open drain output. External 2-kΩ to 5-kΩ pull-up resistor is required. This pin is 3.3-V LVCMOS tolerant.
SDC F12 I/O, 3.3 V LVCMOS, Open Drain SMBus clock input or open drain clock output. External 2-kΩ to 5-kΩ pull-up resistor is required. This pin is 3.3-V LVCMOS tolerant.
READ_EN_N F13 Input, 3.3 V LVCMOS

SMBus master mode (EN_SMB = Float): When asserted low, initiates the SMBus master mode EEPROM read function. Once EEPROM read is complete (indicated by assertion of ALL_DONE_N low), this pin can be held low for normal device operation.

SMBus slave mode (EN_SMB = 1 kΩ to VDD): When asserted low, this causes the device to be held in reset (SMBus state machine reset and register reset). This pin should be pulled high or left floating for normal operation in SMBus slave mode.

This pin has an internal weak pull-up and is 3.3-V LVCMOS tolerant.
ALL_DONE_N D3 Output, LVCMOS

Indicates the completion of a valid EEPROM register load operation when in SMBus master mode (EN_SMB = Float):

High = External EEPROM load failed or incomplete.

Low = External EEPROM load successful and complete.

When in SMBus slave mode (EN_SMB = 1 kΩ to VDD), this output will be high-Z until READ_EN_N is driven low, at which point ALL_DONE_N will be driven low. This behavior allows the reset signal connected to READ_EN_N of one device to propagate to the subsequent devices when ALL_DONE_N is connected to READ_EN_N in an SMBus slave mode application.
Miscellaneous Pins
INT_N F3 No connect in package No connect on package. For applications using DS280MB810 and pin-compatible TI Retimers, this pin can be connected to other devices’ INT_N pins. This is a recommendation for cases where there is a need to support a potential future upgrade to the pin-compatible Retimer device, which uses this pin as an interrupt signal to a system controller.
MUXSEL0_
TEST0		 E2 Input, LVCMOS When operating the cross-point in pin-control mode (Shared Reg_0x05[1]=1), MUXSEL0 controls the cross-point for channels 0–1 and 4–5, and MUXSEL1 controls the cross-point for channels 2–3 and 6–7.

If these pins are not used for cross-point control, they may be left floating or tied to GND. These pins also serve as TI test pins when in test mode (EN_SMB = 10 kΩ to GND).

These pins have an internal weak pull-up.
MUXSEL1_
TEST1		 E14 Input, LVCMOS
Power
VDD D6, D8, D10, E5, E6, E7, E8, E9, E10, F6, F8, F10 Power Power supply, VDD = 2.5 V +/- 5%. Use at least six de-coupling capacitors between the Repeater’s VDD plane and GND as close to the Repeater as possible. For example, four 0.1-μF capacitors and two 1-μF capacitors directly beneath the device or as close to the VDD pins as possible. The VDD pins on this device should be connected through a low-resistance path to the board VDD plane. For more information, see Section 10.
GND A1, A2, A4, A6, A8, A10, A12, A14, A15, B2, B4, B6, B8, B10, B12, B14, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, D1, D2, D4, D5, D7, D9, D11, D12, D14, D15, E4, E11, F1, F2, F4, F5, F7, F9, F11, F14, F15, G2, G3, G4, G5, G6, G7, G8, G9, G10, G11, G12, G13, G14, H2, H4, H6, H8, H10, H12, H14, J1, J2, J4, J6, J8, J10, J12, J14, J15 Power Ground reference. The GND pins on this device should be connected through a low-impedance path to the board GND plane.